초록 ▼

A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to

A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to the chamber. As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

대표청구항 ▼

[ What is claimed is:] [1.] A target assembly removably mountable in an opening in a wall of a vacuum chamber for processing a substrate by causing sputtering material to be ejected from the target assembly onto the substrate, comprising:an adapter having a supporting wall, an outer flange extending

[ What is claimed is:] [1.] A target assembly removably mountable in an opening in a wall of a vacuum chamber for processing a substrate by causing sputtering material to be ejected from the target assembly onto the substrate, comprising:an adapter having a supporting wall, an outer flange extending generally outward from said supporting wall and sized for mounting to said chamber, and an inner flange extending generally inward from said supporting wall;a target of said sputtering material having a generally planar surface, an outer periphery of said target being sized and configured to fit within said supporting wall of said adapter, such that said generally planar surface of said target overlays said inner flange of said adapter; andmechanical couplers mechanically joining said target to said inner flange of said adapter.