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Environmentally controlled circuit pack and cabinet 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0613783 (1996-02-29)
발명자 / 주소
  • Rumbut
  • Jr. John T.
출원인 / 주소
  • The United States of America as represented by the Secretary of the Navy
대리인 / 주소
    McGowan
인용정보 피인용 횟수 : 63  인용 특허 : 4

초록

An apparatus for controlling the operating conditions of individual electic circuit boards and a circuit board cabinet for holding one or more environmentally controlled circuit packs is provided. The enclosure provides both electronic ports and cooling ports. The cooling ports may be used to circul

대표청구항

[ What is claimed is:] [5.] A cabinet for holding multiple circuit card enclosures comprising:an external housing having a plurality of circuit card slots and top, bottom, and side panels;a plurality of mounting means disposed within said external housing, said plurality of mounting means defining t

이 특허에 인용된 특허 (4)

  1. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  2. Scheibler Edy (Wetzikon CHX), Card cage having an air cooling system.
  3. Mizzi John V. (Poughkeepsie NY), Close card cooling method.
  4. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.

이 특허를 인용한 특허 (63)

  1. Helbig, Joerg Burkhard; Gizzi, Steven Thomas, Apparatus and methods for cooling rejected heat from server racks.
  2. Eriksson Mats,SEX, Arrangement and method for the remote cooling of radio transceivers.
  3. Liu, Lianjun; Li, Yao, Cabinet liquid cooling system and cabinet.
  4. Stefanoski,Zoran, Computing platform component cooling with quick disconnect.
  5. Hughes, Phillip N.; Lipps, Robert J., Contact cooled electronic enclosure.
  6. Sonnabend,Werner; Ousmane,Mouhamadou; Braun,Wilfried; Schaffer,Kurt, Cooling arrangement.
  7. Nicolai,Michael; D철rrich,Martin, Cooling array.
  8. Lipp, Robert J.; Hughes, Phillip P., Cooling system for contact cooled electronic modules.
  9. Cheon,Kioan, Cooling system for electronic devices.
  10. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  11. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  12. Borror, Steven A.; Dipaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  13. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  14. Kundapur, Krishnamurthy, Data processing system storage unit, data processing system cooling apparatus and data processing system.
  15. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  16. DeCoursey, Calvin; Powell, Gene E., Digital spread spectrum technique for electromagnetic emission reduction.
  17. DeCoursey, Calvin; Powell, Gene E., Digital spread spectrum technique for electromagnetic emission reduction.
  18. DeCoursey, Calvin; Powell, Gene E., Digital spread spectrum technique for electromagnetic emission reduction.
  19. Knight,Paul A.; Kabrell,Carl Axel Ingemar, Dry-wet thermal management system.
  20. Walz,Andrew A.; Tegart,Donald A., Electrical module and support therefor with integrated cooling.
  21. Gabower,John F., Electromagnetic interference shields for electronic devices.
  22. Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
  23. Bhatti,Mohinder Singh; Reyzin,Ilya; Joshi,Shrikant Mukund, Evaporative cooling system for a data-communications cabinet.
  24. Lundorf, René, Flow distributor assembly and a cooling unit with a flow distributor assembly.
  25. Takemura, Keizou; Wei, Jie; Yamada, Mitsutaka; Aoki, Michimasa; Suzuki, Masumi, Information processing device and cooling unit.
  26. Belady,Christian L., Liquid cooled system module.
  27. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  28. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  29. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using thereof.
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof.
  31. Meijer, Gerhard I.; Schmidt, Derek I.; Steinke, Mark E.; Womble, James S., Liquid-cooled memory system having one cooling pipe per pair of DIMMs.
  32. Cader, Tahir; Ressa, Robert J., Low momentum loss fluid manifold system.
  33. Holmberg Ulf I.,SEX ; Gudmundsson Bjorn,SEX, Method and apparatus for arranging heat transport.
  34. Corrado,Joseph P.; Eberth,John F.; Mazzuca,Steven J.; Schmidt,Roger R.; Tsukamoto,Takeshi, Method and apparatus for cooling electronic components.
  35. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  36. Baer,Daniel B., Method and apparatus for cooling electronic enclosures.
  37. Beitelmal, Abdlmonem H.; Patel, Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  38. Beitelmal, Abdlmonem H.; Patel, Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  39. Beitelmal,Abdlmonem H.; Patel,Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  40. Beitelmal,Abdlmonem H.; Patel,Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  41. Regimbal, Laurent; Archer, Sean; Shafer, Steve; Tufty, Lyle R., Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices.
  42. Regimbal, Laurent; Archer, Sean; Shafer, Steve; Tufty, Lyle R., Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices.
  43. Whitted, William H.; Aigner, Gerald, Modular data center.
  44. Whitted, William H.; Aigner, Gerald, Modular data center.
  45. Olson Robert Leo, Multiple tile scaleable cooling system for semiconductor components.
  46. Miller, Rick, Optical particle sensor with exhaust-cooled optical source.
  47. Breinlinger, Keith; Ostertag, Edward; Sartschev, Ronald A.; Teneketges, Nicholas J., Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment.
  48. Scofield, William H.; Baube, Scott H., Refrigerant line electrical ground isolation device for data center cooling applications.
  49. McCollin Gerald E., Refrigeration system for cooling chips in test.
  50. McCollin Gerald E. ; Hile William Ross, Refrigeration system for cooling chips in test.
  51. Schaltz, Torben Søgaard; Hunskjær, Jan; Henriksen, Kim, Single ended cooling module rows and assemblies for thermal management of in-line memory modules.
  52. Cheon,Kioan, Soft cooling jacket for electronic device.
  53. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Spot cooling evaporator cooling system for integrated circuit chip modules.
  54. Knight,Paul A.; Fales,Brent M., Spray cool system with a dry access chamber.
  55. Knight,Paul A., Spray coolant reservoir system.
  56. Kowalski, Bobby Jim; Denny, Ronald R.; Seward, James T.; Ebsen, Michael P.; Rosenthal, Thomas; Leinberger, William J.; Josephson, Andrew D.; Young, Jeffery Stagg, System and method for interconnecting circuit boards.
  57. Becker,Wiren D.; Corrado,Joseph P.; Cruz,Ethan E.; Fisher,Michael J.; Goth,Gary F., System for airflow management in electronic enclosures.
  58. Brandon,Mark A.; Corrado,Joseph P.; Cruz,Ethan E.; Fisher,Michael J.; Goth,Gary F., System for airflow management in electronic enclosures.
  59. Sishtla Vishnu M. ; Stark Michael A., System for removing parasitic losses in a refrigeration unit.
  60. Whitted, William H., Systems and methods for close coupled cooling.
  61. Martin, Yves; Van Kessel, Theodore G, Thermal ground plane for cooling a computer.
  62. Martin, Yves; Van Kessel, Theodore G., Thermal ground plane for cooling a computer.
  63. Thorson,Kevin J.; Drexler,Gregory M.; Stevens,Rick C.; Sutterfield,Brian D., Thermally conductive shelf.
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