초록 ▼

Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the fo

Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.

대표청구항 ▼

[ What is claimed is:] [1.] Method of forming an overmolded package body on a substrate, comprising:providing a mold having a top mold half with a cavity and a bottom mold half;providing a sealing structure on the top mold half and at a periphery of the cavity, the sealing structure having a ridge,

[ What is claimed is:] [1.] Method of forming an overmolded package body on a substrate, comprising:providing a mold having a top mold half with a cavity and a bottom mold half;providing a sealing structure on the top mold half and at a periphery of the cavity, the sealing structure having a ridge, the ridge having a height in the sealing structure;providing a substrate having a top and a bottom surface;disposing a dam structure on the top surface of the substrate, wherein the dam structure has an edge,forming a groove having a depth in the dam structure edge,adjusting the depth of the groove to obtain a desired distance from the bottom surface of the substrate, whereby a uniform clamping pressure is exerted by the sealing structure on the dam structure, irrespective of the thickness of the substrates;disposing the substrate in the bottom mold half wherein the bottom surface of the substrate is proximate to the bottom mold half and the dam structure opposes the sealing structure;bringing the mold halves together, so that the sealing structure contacts the dam structure so as to form a seal thereby; andfilling the cavity with molding compound.