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Energy-curable cyanate/ethylenically unsaturated compositions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08L-067/07
  • C08F-004/42
출원번호 US-0078981 (1993-06-16)
발명자 / 주소
  • McCormick Fred B.
  • Drath David J.
  • Gorodisher Ilya
  • Kropp Michael A.
  • Palazzotto Michael C.
  • Sahyun Melville R. V.
출원인 / 주소
  • Minnesota Mining and Manufacturing Company
대리인 / 주소
    Sherman
인용정보 피인용 횟수 : 26  인용 특허 : 10

초록

A composition of matter including a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a seco

대표청구항

[ We claim:] [1.] A composition of matter comprising a curable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one ethylenically unsaturated monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent

이 특허에 인용된 특허 (10)

  1. Ayano, Satoshi; Gaku, Morio; Ikeguchi, Nobuyuki; Kinbara, Hidenori; Osaki, Yasunari, Curable resin composition.
  2. Pujol Jean-Marc P. (Rhone MN FRX) Hall Joyce B. (North St. Paul MN) Hogerton Peter B. (White Bear Lake MN) McCormick Fred B. (Maplewood MN) Tingerthal Jeanne M. (White Bear Lake MN), Cyanate ester adhesives for electronic applications.
  3. Halm Leo W. (Blaine MN), Energy curable compositions having improved cure speeds.
  4. McCormick Fred B. (Maplewood MN) Brown-Wensley Katherine A. (Lake Elmo MN) DeVoe Robert J. (St. Paul MN), Energy-curable cyanate compositions.
  5. Brown-Wensley Katherine A. (Lake Elmo MN) DeVoe Robert J. (St. Paul MN) Palazzotto Michael C. (St. Paul MN), Energy-induced curable compositions.
  6. Brown-Wensley Katherine A. (Lake Elmo MN) Devoe Robert J. (St. Paul MN) Palazzotto Michael C. (St. Paul MN), Energy-induced curable compositions.
  7. Gatechair Leslie R. (Katonah NY) Blumenstein Gary M. (Mahopac NY) Schirmann Peter J. (Fairfield CT), Ferrocenium/alpha-cleavage photoinitiator systems for free radical polymerizable compositions.
  8. Jakob ; Hans-Dieter ; Kubens ; Rolf ; Heine ; Heinrich, Hardenable mixtures containing polyfunctional aromatic cyanic acid esters.
  9. Caldwell Donald B. (Lake Elmo MN) Gardeski Thomas F. (North St. Paul MN), High-temperature damping composite.
  10. Hefner ; Jr. Robert E. (Lake Jackson TX), Thermosettable resin composition containing alkenyl phenyl cyanate.

이 특허를 인용한 특허 (26)

  1. Mahoney, Wayne S.; Palazzotto, Michael C., Accelerators for cationic polymerization catalyzed by iron-based catalyst.
  2. Mahoney, Wayne S.; Palazzotto, Michael C., Accelerators for cationic polymerization catalyzed by iron-based catalysts.
  3. Fisk, Jonathan W.; Thurber, Mark C.; Sloan, David M.; Gheyara, Vistasp; Keys, James F., Acrylate-based sound damping material and method of preparing same.
  4. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Adhesive, method of connecting wiring terminals and wiring structure.
  5. Cardellino Terri ; Richards Michael, Apparatus and method for attaching a microelectronic device to a carrier using a photo initiated anisotropic conductive adhesive.
  6. Defoort, Brigitte; Lacour, Dominique; Le-Couls, Olivier, Assembly of prepregs for producing structures, for example ones which deploy through inflation.
  7. Lewno,Jeffrey A, Bonded vehicular glass assemblies utilizing two-component urethanes adhesive.
  8. Ma, Jingwen; DeVoe, Robert J.; Hine, Andrew M.; Thurber, Ernest L.; Kincaid, Don H., Coated substrate with energy curable cyanate resin.
  9. Chang Shyh-Ming,TWX ; Lee Yu-Chi,TWX ; Jou Jwo-Huei,TWX, Composite bump structures.
  10. McCormick, Fred Boyle; Baude, Paul Frederic; Vernstrom, George David, Encapsulated organic electronic devices and method for making same.
  11. McCormick, Fred Boyle; Baude, Paul Frederic; Vernstrom, George David, Encapsulated organic electronic devices and method for making same.
  12. McCormick, Fred B.; Baude, Paul F.; Haase, Michael A., Encapsulation of organic electronic devices using adsorbent loaded adhesives.
  13. Papathomas, Konstantinos I.; Joan Cangelosi; Dittrich, Deborah L.; Wang, David W.; Fuerniss, Stephen J., Lead protective coating composition, process and structure thereof.
  14. Repp, R. Scott; Stallman, Pamela M., Method for making an articulatable vehicular window assembly.
  15. Lewno, Jeffrey A., Method for manufacturing an articulatable vehicular window assembly.
  16. Sahagun, Christopher; Guenthner, Andrew; Mabry, Joseph, Method for producing cyanurate networks via inductive heating of silica-coated magnetic nanoparticles.
  17. Lukowski, Jr., Florian P.; Shaheen, Paul M.; Chu, Charles, Modules and systems for damping excitations within fluid-filled structures.
  18. Jauer, Stephan; Papenbroock, Marten, Pressure-sensitive adhesive composition having an improved release behavior.
  19. Fang, Xiaomei; Miebach, Thomas; Simon, David; Seeger, Jordan Philip, UV-IR combination curing system and method of use for wind blade manufacture and repair.
  20. Lewno, Jeffrey A., Vehicular rear sliding window assembly.
  21. Lewno, Jeffrey A., Vehicular rear sliding window assembly.
  22. Lewno, Jeffrey A., Vehicular sliding window assembly.
  23. Repp, R. Scott; Stallman, Pamela M., Window assembly for vehicle.
  24. Repp,R. Scott; Stallman,Pamela M, Window assembly suitable for use in a vehicle.
  25. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles.
  26. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Wiring terminal-connecting adhesive.
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