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특허 상세정보

Robotic wafer handler

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B25J-009/06   
미국특허분류(USC) 414/744.5 ; 414/935 ; 901/015 ; 901/021 ; 74/490.04
출원번호 US-0589554 (1996-01-22)
발명자 / 주소
  • Tepolt Gary B.
출원인 / 주소
  • Integrated Solutions, Inc.
대리인 / 주소
    Weingarten, Schurgin, Gagnebin & Hayes LLP
인용정보 피인용 횟수 : 67  인용 특허 : 49
초록

A robotic wafer handler has first and second arms pivotally connected at a swing point to operate in a plane. Each arm is independently drivable through greater than 360.degree. of rotation in the plane. The wafer handler may also include mechanisms for adjusting the plane of rotation, i.e., for providing lift and tilt.

대표
청구항

[ What is claimed is:] [1.] A robotic wafer handler comprising:a first drive mechanism;a first arm portion coupled to said first drive mechanism, and drivable by said first drive mechanism through 360 degrees of rotation;a second drive mechanism;a second arm portion coupled to said second drive mechanism, and pivotally engaged with said first arm portion, said second arm portion drivable by said second drive mechanism through more than 360 degrees of rotation with respect to said first arm portions;a lift mechanism coupled to said first arm portion, said...

인용문헌 (49)

  1. Davis Cecil J. (Greenville TX) Wooldridge Timothy J. (Richardson TX) Carter Duane E. (Plano TX), Advanced vacuum processor.
  2. Thurfjell Henrik (Sunnyvale CA) Ozarski Robert G. (Livermore CA), Apparatus and process for positioning wafers in receiving devices.
  3. Richards Edmond A. (Marlton NJ), Apparatus for conveying a semiconductor wafer.
  4. Ishii Katsumi (Fujino JPX) Mochizuki Yoshinori (Hachioji JPX), Arm apparatus for conveying semiconductor wafer and processing system using same.
  5. Hardegen E. Brian (Westford MA) Bottomley Todd E. (Swamzey NH) Davis ; Jr. James C. (Carlisle MA), Articulated arm transfer device.
  6. Davis Cecil J. (Greenville TX) Johnson Randall E. (Carrollton TX) Spencer John E. (Plano TX), Automated plasma reactor.
  7. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Jucha Rhett B. (Celeste TX) Brown Frederick W. (Tarrant TX) Kohan Stanford P. (Garland TX), Automated single slice cassette load lock plasma reactor.
  8. Davis Cecil J. (Greenville TX) Spencer John E. (Plano TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Brown Frederick W. (Colleyville TX) Kohan Stanford P. (Garland TX), Automated single slice powered load lock plasma reactor.
  9. Layton Howard M. (New Fairfield CT), Automated work transfer system having an articulated arm.
  10. Kimata Kazuo (Bisai JPX) Ishikawa Susumu (Aichi JPX), Carrier system for silicon wafer.
  11. Sawada Yasuhiro (Chofu JPX) Azuma Yusaku (Yokohama JPX) Yasuhara Masateru (Kawasaki JPX), Clean robot.
  12. Mitsui Tadashi (Yamanashi JPX) Saito Susumu (Kofu JPX), Handling apparatus for transferring a semiconductor wafer or LCD.
  13. Tokisue Hiromitsu (Ibaraki JPX) Kitsunai Hiroyuki (Ibaraki JPX) Tsumaki Nobuo (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Holder device and semiconductor producing apparatus having same.
  14. Ishii Katsumi (Fujino JPX) Mochizuki Yoshinori (Hachioji JPX), Horizontal/vertical conversion handling apparatus.
  15. Gorman, Robert H., Industrial robot having direct coaxial motor drive.
  16. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Bowling Robert A. (Garland TX), Integrated circuit processing system.
  17. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Bowling Robert A. (Garland TX), Integrated circuit processing system.
  18. Hugues Jean B. (Tempe AZ) Weber Lynn (Saratoga CA) Herlinger James E. (Palo Alto CA) Nishikawa Katsuhito (San Jose CA) Schuman Donald L. (Saratoga CA) Yee Gary W. (Santa Clara CA), Method and apparatus for transferring wafers between cassettes and a boat.
  19. Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Hawkins Mark R. (Mesa AZ) Goodwin Dennis L. (Tempe AZ) Ferro Armand P. (Scottsdale AZ), Method for loading a substrate into a GVD apparatus.
  20. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown MA) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Method providing multiple-processing of substrates.
  21. Koch George R. (Los Altos CA) Petersen ; III Carl T. (Fremont CA), Modular loadlock.
  22. Stark Lawrence R. (San Jose CA) Turner Frederick (Sunnyvale CA), Modular wafer transport and processing system.
  23. Uehara Akira (Kanagawa JPX) Hijikata Isamu (Kanagawa JPX) Minato Mitsuaki (Kanagawa JPX), Object handling device.
  24. Spencer John E. (Plano TX) Johnson Randall E. (Carrollton TX) Hockersmith Dan T. (Garland TX) Hildenbrand Randall C. (Richardson TX) Jones John I. (Plano TX) Jaspersen William S. (Dallas TX), Powered load lock electrode/substrate assembly including robot arm, optimized for plasma process uniformity and rate.
  25. Genov Genco (Sunnyvale CA) Skrobak Lubomir (Sunnyvale CA) Kremerman Izya (San Francisco CA) Kielczewski Grzegorz (San Bruno CA), Precision arm mechanism.
  26. Skrobak Lubomir (Mountain View CA), Precision robot apparatus.
  27. Asakawa Teruo (Yamanashi JPX) Osawa Tetsu (Sagamihara JPX) Hosaka Noboru (Yamanashi JPX), Processing system.
  28. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  29. Maher Joseph A. (South Hamilton MA) Vowles E. John (Goffstown NH) Napoli Joseph D. (Winham NH) Zafiropoulo Arthur W. (Manchester MA) Miller Mark W. (Burlington MA), Quad processor.
  30. Tamai Tadamoto (Tokyo JPX) Okada Keiji (Ehime JPX), Robot arm capable of three-dimensionally moving a robot arm member.
  31. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Hildenbrand Randall C. (Richardson TX), Semiconductor wafer transfer method and arm mechanism.
  32. Sandbach Rex H. (Stockport GBX) Poole Alan (Macclesfield GBX), Step and repeat apparatus.
  33. Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Hawkins Mark R. (Mesa AZ) Goodwin Dennis L. (Tempe AZ) Ferro Armand P. (Scottsdale AZ), Substrate handling and transporting apparatus.
  34. Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Hawkins Mark R. (Mesa AZ) Goodwin Dennis L. (Tempe AZ) Ferro Armand P. (Scottsdale AZ) deBoer Wiebe B. (Eersel OR NLX) Ozias Albert E. (, Substrate loading apparatus for a CVD process.
  35. Strahl Thomas L. (Fremont CA) Lamont ; Jr. Lawrence T. (San Jose CA) Peterson Carl T. (Fremont CA) Brown Hobart A. (Santa Cruz CA) McCormick Lonnie W. (Cupertino CA) Mosely Roderick C. (Mountain View, System and method for processing workpieces.
  36. Tanaka Hiroshi (Kurume JPX) Nishi Mitsuo (Kurume JPX) Mizoguchi Ryuichi (Kumamoto JPX) Kamikawa Yuuji (Uto JPX), Transfer apparatus.
  37. Davis Cecil J. (Greenville TX) Matthews Robert (Plano TX) Hildenbrand Randall C. (Richardson TX), Vacuum processing system.
  38. Bednorz Johannes G. (Adliswil CHX) Gueret Pierre L. (Richterswil CHX) Nievergelt Hermann E. (Adliswil CHX) Ott Hanspeter (Thalwil CHX) Pohl Wolfgang D. (Adliswil CHX) Widmer Daniel F. (Hirzel CHX), Vacuum transfer device.
  39. Layman Frederick P. (Fremont CA) Hobson Phillip M. (Los Altos CA) Dick Paul H. (San Jose CA), Valve incorporating wafer handling arm.
  40. Messer Mark G. (Los Gatos CA) Stark Lawrence R. (San Jose CA), Wafer arm handler mechanism.
  41. Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX), Wafer cleaning method and apparatus therefore.
  42. Iwata Yoshiki (Yamato JPX), Wafer handling apparatus.
  43. Sato Mitsuya (Yokohama JPX) Imai Shunzo (Yamato JPX) Hiraga Ryozo (Kanaga JPX), Wafer handling apparatus and method.
  44. Goodwin Dennis L. (Tempe AZ) Crabb Richard (Mesa AZ) Robinson McDonald (Paradise Valley AZ) Ferro Armand P. (Scottsdale AZ), Wafer handling system with bernoulli pick-up.
  45. Purser, Kenneth H., Wafer holding apparatus for ion implantation.
  46. Hobson Phillip M. (Los Altos CA) Dick Paul H. (San Jose CA), Wafer processing chuck using slanted clamping pins.
  47. Layman Frederick P. (Fremont CA) Huntley David A. (Mountain View CA) Dick Paul H. (San Jose CA) Coad George L. (Lafayette CA) Kuhlman Michael J. (Fremont CA) Vecta Roger M. (San Jose CA) Hobson Phill, Wafer processing system.
  48. Ohtani Masami (Kyoto JPX) Nishida Masami (Kyoto JPX), Wafer transfer apparatus having an improved wafer transfer portion.
  49. Takanabe Eiichiro (Kanagawa JPX), Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus prov.

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  3. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
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  5. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  6. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  7. Harris,Randy; Woodruff,Daniel J., Apparatus for manually and automatically processing microelectronic workpieces.
  8. Harris,Randy A.; Hanson,Kyle M., Apparatuses and method for transferring and/or pre-processing microelectronic workpieces.
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  10. Sagues Paul ; Peurach John T. ; Aggarwal Sanjay D., Automatic calibration system for wafer transfer robot.
  11. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  12. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  13. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
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  15. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  16. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  17. Ma Edmund L. ; Lada Christopher O. ; Langhans Donald H., End effector for substrate handling and method for making the same.
  18. Woodruff, Daniel J.; Erickson, James J., End-effectors and transfer devices for handling microelectronic workpieces.
  19. Woodruff,Daniel J.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic wafers.
  20. Woodruff,Daniel J.; Oberlitner,Thomas H.; Harris,Randy A.; Erickson,James J.; Carr,Douglas W., End-effectors for handling microelectronic workpieces.
  21. Woodruff, Daniel J.; Harris, Randy, Integrated tools with transfer devices for handling microelectronic workpieces.
  22. Asdigha,Mehran; Cleveland,Kurt D.; Krishnasamy,Jay; Ota,Kan, Mechanical oscillator for wafer scan with spot beam.
  23. Birkner, Andreas; Bernhardt, Frank; Hiltawski, Knut, Method and arrangement for transporting and inspecting semiconductor substrates.
  24. Birkner,Andreas; Bernhardt,Frank; Hiltawski,Knut, Method and arrangement for transporting and inspecting semiconductor substrates.
  25. Vanderpot,John W.; Pollock,John D.; Berrian,Donald W., Method for reciprocating a workpiece through an ion beam.
  26. Woodruff, Daniel J.; Harris, Randy, Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces.
  27. Olgado, Donald J.; Tepman, Avi; Franklin, Timothy J., Multiple blade robot adjustment apparatus and associated method.
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  30. Vanderpot,John W.; Pollock,John D.; Berrian,Donald W., Reciprocating drive for scanning a workpiece.
  31. Vanderpot,John W.; Pollock,John D.; Berrian,Donald W., Reciprocating drive for scanning a workpiece through an ion beam.
  32. Greene, Jr., Daniel Lawson; Sinicki, Ron; Woolley, Kurt, Reticle stop block apparatus and method.
  33. Greene, Jr., Daniel Lawson; Sinicki, Ron; Woolley, Kurt, Reticle stop block apparatus and method.
  34. Guerra,Lawrence E., Robotic arm for use with pharmaceutical unit of use transport and storage system.
  35. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  36. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  37. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  38. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  39. Jeffrey M. Snow, Scara type robot with counterbalanced arms.
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  42. Hanson, Kyle; Dix, Mark; Woodruff, Daniel J.; Schmidt, Wayne J.; Coyle, Kevin W., Semiconductor processing apparatus having linear conveyer system.
  43. Kung Chris Wu ; John M. Rush ; Torben Ulander, Simplified and enhanced SCARA arm.
  44. Koyama,Yoshihiro; Mizohata,Yasuhiro, Substrate processing apparatus and substrate processing method.
  45. Beaulieu, David R., Substrate transport apparatus with coaxial drive shafts and dual independent scara arms.
  46. Pippin,James M., System and apparatus for driving a track mounted robot.
  47. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  48. Woodruff, Daniel J.; Harris, Randy, TRANSFER DEVICES FOR HANDLING MICROELECTRONIC WORKPIECES WITHIN AN ENVIRONMENT OF A PROCESSING MACHINE AND METHODS OF MANUFACTURING AND USING SUCH DEVICES IN THE PROCESSING OF MICROELECTRONIC WORKPIE.
  49. Kimata Kazuo,JPX ; Kato Katsuhiko,JPX, Thin substrate transferring apparatus.
  50. Hiroki, Tsutomu, Transfer apparatus and accommodating apparatus for semiconductor process, and semiconductor processing system.
  51. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  52. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  53. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  54. Costa Larry J., Two-axis cartesian robot.
  55. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  56. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  57. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  58. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  59. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  60. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  61. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  62. Ioannou,Michael; Asdigha,Mehran; Ferrara,Joseph, Wafer 2D scan mechanism.
  63. Sagues Paul ; Gaudio Stephen A. ; Wong Tim K., Wafer aligner system.
  64. Kim Jae Pil,KRX ; Cheong Yong Joon,KRX, Wafer handling apparatus for transferring a wafer to and from a process chamber.
  65. Blank, Richard M., Wafer handling robots with rotational joint encoders.
  66. Kellerman,Peter L.; Benveniste,Victor M.; Saadatmand,Kourosh; Asdigha,Mehran; Brown,Douglas A., Wafer scanning system with reciprocating rotary motion utilizing springs and counterweights.
  67. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.