초록 ▼

An array of thermal sensitive elements (16) may be formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of electrically conductive contacts (60) is formed to define in part masked (61) and unmasked (68) regions of th

An array of thermal sensitive elements (16) may be formed from a pyroelectric substrate (46) having an infrared absorber and common electrode assembly (18) attached thereto. A first layer of electrically conductive contacts (60) is formed to define in part masked (61) and unmasked (68) regions of the substrate (46). A second layer of electrically conductive contacts (62) may be formed on the first layer of contacts (60). A mask layer (66) is formed to encapsulate the exposed portions of the second layer of contacts (62). The unmasked regions (68) are exposed to an etchant (70) and irradiated to substantially increase the reactivity between the unmasked regions (68) and the etchant (70) such that during irradiation, the etchant (70) removes the unmasked regions (68) substantially faster than the first layer of contacts (60) and the mask layer (66).

대표청구항 ▼

[ What is claimed is:] [1.] A method for forming an array of thermal sensitive elements from a substrate of thermal sensitive material having portions of an infrared absorber and common electrode assembly attached thereto, comprising:forming a first layer of electrically conductive contacts on one s

[ What is claimed is:] [1.] A method for forming an array of thermal sensitive elements from a substrate of thermal sensitive material having portions of an infrared absorber and common electrode assembly attached thereto, comprising:forming a first layer of electrically conductive contacts on one side of said substrate to at least partially define masked and unmasked regions thereof;forming a second layer of electrically conductive contacts on said first layer of contacts;encapsulating the exposed portions of said second layer of contacts with a mask layer;exposing said unmasked regions of said substrate to an etchant;irradiating said unmasked regions with electromagnetic energy to substantially increase the reactivity between said unmasked regions and said etchant; andwherein during said step of irradiating, said etchant etches said unmasked regions substantially faster than said first layer of contacts and said mask layer.