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Method of laser forming a slot 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
출원번호 US-0555653 (1995-11-13)
발명자 / 주소
  • Rockstroh Todd J.
  • Crow John M.
  • Lee Ching-Pang
  • Risbeck James D.
출원인 / 주소
  • General Electric Company
대리인 / 주소
    Hess
인용정보 피인용 횟수 : 56  인용 특허 : 13

초록

A method for forming a slot in a metal component having first and second opposite surfaces utilizes a first laser beam having a pulse rate and power to vaporize the metal. The laser beam is traversed across the first surface at a feed rate so that each beam pulse vaporizes the component metal at a s

대표청구항

[ Accordingly, what is desired to be secured by Letters Patent of the United States is the invention as defined and differentiated in the following claims:] [1.] A method for forming a slot in a metal component having first and second opposite surfaces spaced apart at a thickness, comprising the ste

이 특허에 인용된 특허 (13)

  1. Vertz Richard J. (Congers NY) Mosavi Reza K. (Monsey NY), Airfoil with diffused cooling holes and method and apparatus for making the same.
  2. Burke Victor B. (Akron OH) Burkholder Charles R. (Akron OH), Automatic layout machine for tire tread patterns.
  3. Lee Ching-Pang (Cincinnati OH) Wheat Gary E. (Madisonville KY) Malone Barry T. (Dawson Springs KY) Palmer Nicholas C. (Loveland OH) Simmons Robert C. (Cincinnati OH), Cooled airfoil tip corner.
  4. Auxier Thomas A. (Lake Park FL) Field Robert E. (Tequesta FL), Film coolant passages for cast hollow airfoils.
  5. Stroud David (Bristol GB2) Corfe Arthur G. (Bristol GB2) Towill Jonathan P. W. (Cardiff GB7) Cooper Brian G. (Derby GB2), Film cooled components.
  6. Lee Ching-Pang (Cincinnati OH) Prakash Chander (West Chester OH) Starkweather John H. (Cincinnati OH) Zerkle Ronald D. (Cincinnati OH), Film cooled slotted wall.
  7. Wakeman Thomas G. (Lawrenceburg OH IN) Walker Alan (Wyoming OH) Maclin Harvey M. (Cincinnati OH), Gas turbine engine multi-hole film cooled combustor liner and method of manufacture.
  8. Sidenstick James E. (Cincinnati OH), Method and apparatus for forming diffused cooling holes in an airfoil.
  9. Lozier Todd B. (Hamilton OH) Kelley James G. (California KY), Method and apparatus for laser trepanning.
  10. Adamski Edward G. (Middletown CT), Method for forming shaped passages.
  11. Chadha Surjit S. (Meridian ID), Method for particulate-free energy beam cutting of a wafer of die assemblies.
  12. Behn Reinhard (Munich DEX), Method for the formation of narrow, metal-free strips in a metal layer on plastic sheets.
  13. Gale Preston Lee (East Peoria IL) Stafford Warren Jess (Peoria IL), Method of and means for cutting hose for high pressure hydraulic systems.

이 특허를 인용한 특허 (56)

  1. Lee, Ching Pang; Wadia, Aspi Rustom; Cherry, David Glenn; Han, Je Chin, Airfoil leading edge end wall vortex reducing plasma.
  2. Liu, Xinbing; Li, Ming, Apparatus for drilling holes with sub-wavelength pitch with laser.
  3. Fried,Reinhard; Rathmann,Ulrich, Base material with cooling air hole.
  4. Steibel, James Dale; Edmondson, Wayne Garcia; Scheidt, Wilbur Douglas, Ceramic matrix composite turbine components.
  5. Kling, Carl C., Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure.
  6. Lee, Ching-Pang; Wadia, Aspi Rustom; Cherry, David Glenn; Han, Je-Chin, Downstream plasma shielded film cooling.
  7. Ramachandran, Dhinagaran; Muthiah, Gopal Samy; Venkataramanan, Jyothishkumar; Srinivasan, Balamurugan; Liu, Jong; Tapia, Luis; Crites, Daniel Cregg; Malak, Malak Fouad, Gas turbine engine components with cooling hole trenches.
  8. Malak, Malak Fouad; Rana, Rajiv; Tapia, Luis; Chou, David; Liu, Jong, Gas turbine engine components with film cooling holes having cylindrical to multi-lobe configurations.
  9. Venkataramanan, Jyothishkumar; Muthiah, Gopal Samy; Ramachandran, Dhinagaran; Srinivasan, Balamurugan; Malak, Malak Fouad; Liu, Jong; Tapia, Luis; Crites, Daniel, Gas turbine engine components with improved film cooling.
  10. Morris, Mark C.; Waldman, David; Malak, Malak Fouad; Tapia, Luis, Gas turbine engine components with lateral and forward sweep film cooling holes.
  11. Chang, Jim J.; Friedman, Herbert W.; Comaskey, Brian J., High precision, rapid laser hole drilling.
  12. Hu, Zhaoli, Laser assisted casting of cooling hole and related system.
  13. Hu, Zhaoli, Laser assisted casting of cooling hole and related system.
  14. Hu, Zhaoli, Laser assisted casting of surface texture and related system.
  15. Hu, Zhaoli, Laser assisted casting of surface texture and related system.
  16. Boyle, Adrian; Meighan, Oonagh; Walsh, Gillian; Mah, Kia Woon, Laser machining system and method.
  17. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki, Laser processing method.
  18. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  19. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  20. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  21. Xinbing Liu ; Ming Li, Method and apparatus for drilling holes with sub-wavelength pitch with laser.
  22. Bunker, Ronald Scott; Zhang, Wenwu; Scheidt, Wilbur Douglas; Azer, Magdi Naim; Jones, Marshall Gordon; Lee, Ching-Pang, Method and apparatus for laser cutting a trench.
  23. Chen Xiangli, Method and apparatus for laser drilling.
  24. Osako, Yasu; Finn, Daragh, Method and apparatus for laser singulation of brittle materials.
  25. Osako, Yasu; Finn, Daragh, Method and apparatus for laser singulation of brittle materials.
  26. Beck, Thomas; Settegast, Silke, Method for producing a hole.
  27. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate and method of manufacturing a semiconductor device.
  28. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device.
  29. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device.
  30. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a wafer-like object and semiconductor chip.
  31. Garry, Ian M.; Wybrow, Michael N., Method of cutting with a laser.
  32. Todd J. Rockstroh ; Wilbur D. Scheidt ; Clarence A. Ash, Method of forming cooling holes.
  33. James Dale Steibel ; Wayne Garcia Edmondson ; Wilbur Douglas Scheidt, Method of forming cooling holes in a ceramic matrix composite turbine components.
  34. Lee, Doh-Hyoung; Jeong, Da Hee, Method of manufacturing a metal mask by laser cutting.
  35. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of manufacturing a semiconductor device formed using a substrate cutting method.
  36. Shih, Tom I-P; Na, Sangkwon, Momentum preserving film-cooling shaped holes.
  37. Crow, Jr., John Wesley, Nose landing gear rigging alignment tool holding fixture.
  38. Karl-Hermann Richter DE; Josef Reischl DE; Hans Juergen Schmuhl DE; Klaus Breitschwerdt DE; Ulrich Knott DE; Siegfried Boettcher DE; Karlheinz Manier DE; Werner Humhauser DE, Nozzle ring for a gas turbine.
  39. Fahndrich, Marc, Percussion drilled shaped through hole and method of forming.
  40. Liu, Xinbing; Li, Ming, Photonic crystal formed by laser machining and having holes with sub-wavelength pitch.
  41. Raichle, Florian, Piercing metal workpieces by a laser beam.
  42. Hu, Zhaoli, Process cycle including laser assisted casting and related system.
  43. Hu, Zhaoli, Process cycle including laser assisted casting and related system.
  44. Loringer, Gary, Process for drilling holes through a thermal barrier coating.
  45. Münzer, Jan; Podgorski, Thomas, Process for producing a hole using different laser positions.
  46. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  47. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  48. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  49. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  50. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  51. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  52. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  53. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  54. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  55. Ramachandran, Dhinagaran; Srinivasan, Balamurugan; Muthiah, Gopal; Venkataramanan, Jyothishkumar; Liu, Jong; Tapia, Luis; Malak, Malak Fouad, Turbine engine components.
  56. Lee, Ching Pang; Wadia, Aspi Rustom; Cherry, David Glenn; Han, Je Chin, Upstream plasma shielded film cooling.
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