이 특허를 인용한 특허 (48)

1. Goren, Yehuda G.; Chen, Tong, Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes.

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2. Kierse, Oliver; Hynes, Eamon, Control aperture for an IR sensor.

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3. Gross,Harald, Dissociated fabrication of packages and chips of integrated circuits.

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4. Radu, Sergiu; Sen, Bidyut K.; Hockanson, David; Will, John E., EMI grounding pins for CPU/ASIC chips.

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5. Radu, Sergiu; Boyle, Steven R., EMI heatspreader/lid for integrated circuit packages.

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6. Webster, Steven; Arellano, Tony; Hollaway, Roy Dale, Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area.

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7. Lemke, Timothy A.; Houtz, Timothy W., High density connector and method of manufacture.

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8. Lemke,Timothy A.; Houtz,Timothy W., High density connector and method of manufacture.

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9. Lemke,Timothy A.; Houtz,Timothy W., High density connector and method of manufacture.

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10. Chiu, Wen-Wen, IC chip package.

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11. Chiu, Wen-Wen, IC chip package.

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12. Huang, Chien-Ping, Image sensor of a quad flat package.

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13. Thomas P. Glenn ; Steven Webster, Image sensor package having sealed cavity over active area.

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14. Bolken,Todd O.; Cobbley,Chad A., Image sensor packages.

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15. Webster, Steven; Arellano, Tony; Hollaway, Roy Dale, Integrally connected image sensor packages having a window support in contact with a window and the active area.

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16. Lam, Ken M., Integrated IC chip package for electronic image sensor die.

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17. Camacho, Zigmund Ramirez; Tay, Lionel Chien Hui; Bathan, Henry Descalzo; Advincula, Abelardo Jr. Hadap, Integrated circuit package system with planar interconnect.

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18. Maund Brigg,GBX, Lead frame attachment for optoelectronic device.

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19. Chen, Tong; Chai, Suchet P., Method of packaging a device with a lead frame, and an apparatus formed therefrom.

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20. Bolken,Todd O.; Cobbley,Chad A., Methods of fabrication of package assemblies for optically interactive electronic devices.

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21. Bolken, Todd O.; Cobbley, Chad A., Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor.

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22. Bolken, Todd O.; Cobbley, Chad A., Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor.

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23. Bolken, Todd O.; Cobbley, Chad A., Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor.

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24. Crane, Jr., Stanford W.; Alcaria, Vicente D.; Jeon, Myoung-Soo, Micro grid array semiconductor die package.

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25. Glenn Thomas P., Mounting for a semiconductor integrated circuit device.

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26. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.

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27. Williams, Anthony David, Noise canceling technique for frequency synthesizer.

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28. Kunii Hideo,JPX ; Take Toshiyuki,JPX ; Inoguchi Hiroshi,JPX ; Ishikawa Tsutomu,JPX ; Arai Masashi,JPX ; Kobori Hiroshi,JPX ; Seyama Hiroki,JPX ; Takada Kiyoshi,JPX ; Sekiguchi Satoru,JPX, Optical semiconductor device and optical semiconductor module equipped with the same.

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29. Weekamp, Johannes Wilhelmus; Van Den Ackerveken, Antonius Constant Johanna Cornelis; Ansems, Will J. H., Package carrier for a microelectronic element.

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30. Weekamp, Johannes Wilhelmus; Van Den Ackerveken, Antonius Constan Johanna Cornelis; Ansems, Will J. H., Package carrier for enclosing at least one microelectronic device.

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31. Kirby,Kyle K., Packaged microelectronic imagers and methods of packaging microelectronic imagers.

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32. Hoffman, Paul Robert, Quick sealing glass-lidded package.

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33. Hoffman, Paul Robert, Quick sealing glass-lidded package fabrication method.

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34. Kierse, Oliver; Hynes, Eamon, Radiation sensor device and method.

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35. Vittu,Julien, Semiconductor package.

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36. Goren, Yehuda G.; Lally, Philip M., Slow wave structure having offset projections comprised of a metal-dielectric composite stack.

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37. Sano Yoshikazu,JPX ; Terakawa Sumio,JPX ; Tsujii Eiichi,JPX ; Asaumi Masaji,JPX ; Chatani Yoshikazu,JPX, Solid-state image sensing apparatus and manufacturing method thereof.

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38. Nakada Shinichi,JPX, Solid-state image sensing device.

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39. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Loo, Neo Yong; Kwang, Chua Swee, Stackable semiconductor package and wafer level fabrication method.

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40. Farnworth, Warren M.; Wood, Alan G.; Brooks, Mike, Stackable semiconductor package having conductive layer and insulating layers.

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41. Warren M. Farnworth ; Alan G. Wood ; Mike Brooks, Stackable semiconductor package having conductive layer and insulating layers and method of fabrication.

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42. Warren M. Farnworth ; Alan G. Wood ; Mike Brooks, Stackable semiconductor package having conductive layer and insulating layers and method of fabrication.

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43. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Stacked semiconductor package and method of fabrication.

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44. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Stacked semiconductor package and method of fabrication.

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45. Thomas P. Glenn, Surface acoustical wave flip chip.

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46. Poo, Chia Yong; Jeung, Boon Suan; Waf, Low Siu; Yu, Chan Min; Loo, Neo Yong; Kwang, Chua Swee, Wafer level stackable semiconductor package.

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47. Thomas P. Glenn ; Steven Webster ; Tony Arellano PH, Wafer scale image sensor package.

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48. Glenn, Thomas P.; Webster, Steven; Arellano, Tony, Wafer scale image sensor package fabrication method.

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