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Cobalt-tin alloys and their applications for devices, chip interconnections and packaging 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-018/36
  • C23C-018/50
출원번호 US-0518903 (1995-08-24)
발명자 / 주소
  • Brusic Vlasta A.
  • Marino Jeffrey Robert
  • O'Sullivan Eugene John
  • Sambucetti Carlos Juan
  • Schrott Alejandro Gabriel
  • Uzoh Cyprian Emeka
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Strunck
인용정보 피인용 횟수 : 220  인용 특허 : 0

초록 ▼

A process for electrolessly depositing cobalt-tin alloys with adjustable tin contents from 1 to over 25 atomic percent tin is disclosed. The deposited alloy is useful in the electronics and computer industries for device, chip interconnection and packaging applications. When used for chip interconne

대표청구항 ▼

[ Having thus described our invention, what we claim as new and desire to secure by letters patent is as follows:] [1.] A solution for the electroless deposition of cobalt-tin-phosphorus alloys comprising:a) a cobalt salt plus a tin salt;b) a complexing agent;c) a phosphorus-bearing reducing agent;

이 특허를 인용한 특허 (220)

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