초록 ▼

Optoelectronic interconnections can provide a practical solution for the ever increasing communication bottleneck problems when combining a multitude of information processing units to perform a function. As research activities progress in the field of serial or parallel board-to-board and module-to

Optoelectronic interconnections can provide a practical solution for the ever increasing communication bottleneck problems when combining a multitude of information processing units to perform a function. As research activities progress in the field of serial or parallel board-to-board and module-to-module interconnections, some of the research focus has shifted to smaller physical dimensions, like intra-module interconnections, which combines optoelectronic interconnections, multichip module packaging, and microelectromechanical system (MEMS) technologies at the module level. The present invention provides integrated optical input/output (I/O) couplers on multichip modules (MCMs) using micro-machined silicon mirrors that are used with optoelectronic multichip modules (OE-MCMs). The present invention used microstructures that integrate optical waveguide networks, multilayer electrical transmission line networks, micro-machined silicon mirrors, and C4-bonded photonic devices into a single structure. Using both sides of the silicon wafers, multiple metal layers and optical waveguide layers are fabricated for all types of metal or optical waveguide materials. The input/output coupling arrangement utilizes a combination of micro-machined silicon mirrors and through-holes across OE-MCM, integrated together into a single package. Fabrication strategies and possible applications of the invention are disclosed herein.

대표청구항 ▼

[ I claim:] [1.] An optoelectronic multichip module (OE-MCM) assembly, comprising:a substantially planar substrate having a first side and a second side, said first side having at least one integrated optical waveguide fabricated thereto, said second side having at least one integrated electrically

[ I claim:] [1.] An optoelectronic multichip module (OE-MCM) assembly, comprising:a substantially planar substrate having a first side and a second side, said first side having at least one integrated optical waveguide fabricated thereto, said second side having at least one integrated electrically conductive pathway fabricated thereto;said substrate, said at least one optical waveguide, and said at least one electrically conductive pathway each containing a plurality of through-holes that are located at pre-determined positions at any location upon said substrate, each of said through-holes being in alignment throughout its open area through each of said substrate, optical waveguide, and electrically conductive pathway; andsaid at least one optical waveguide and said at least one electrically conductive pathway being fabricated onto said substrate in a batch mode with no fabrication compatibility problems.