초록 ▼

A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The condu

A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.

대표청구항 ▼

[ We claim:] [1.] A shielding cover in combination with an electrical assembly, said electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, and a conductive frame which is disposed about the electronic component and which is electri

[ We claim:] [1.] A shielding cover in combination with an electrical assembly, said electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, and a conductive frame which is disposed about the electronic component and which is electrically connected to said ground, said conductive frame having at least a mounting surface, said shielding cover comprising:a lid; andan electrically conductive adhesive disposed between the conductive frame and said lid, said electrically conductive adhesive having a substrate having numerous passageways through the substrate, the passageways being defined by a plurality of internal surfaces having disposed thereon a laver of conductive metal, said passageways being at least partially filled with a nonconductive adhesive resin.