초록 ▼

Heat generated at heat generating components is efficiently transported to a wall of a metal box serving as a heat dissipation section to cool the heat generating components even in an apparatus, in which box the heat generating components together with other components are mounted. The heat generat

Heat generated at heat generating components is efficiently transported to a wall of a metal box serving as a heat dissipation section to cool the heat generating components even in an apparatus, in which box the heat generating components together with other components are mounted. The heat generating components and the heat dissipation section are connected to each other through a thermal transport device having a flexible structure. The heat generating components and the box are readily connected to each other irrespective of the arrangement of components, and heat is efficiently transported by driving the liquid. In the heat dissipation section, because the heat generating components and the wall of the metal box are thermally connected to each other, a high heat dissipation capacity is obtained as heat is diffused extensively into the wall due to a high thermal conductivity of the metal box.

대표청구항 ▼

[ What is claimed is:] [2.] A cooling unit for electronic equipment, comprising a first box containing an electronic circuit board, a plurality of semiconductor devices and a keyboard, a second box made of metal and containing a flat-type display unit arranged to face the keyboard in a position in w

[ What is claimed is:] [2.] A cooling unit for electronic equipment, comprising a first box containing an electronic circuit board, a plurality of semiconductor devices and a keyboard, a second box made of metal and containing a flat-type display unit arranged to face the keyboard in a position in which the first and second boxes face each other to define a closed position with the second box having a wall constituting a lid, said second box having fins with one end contacting the wall and the other ends being free non-contacting ends each extending inwardly toward the display unit, a heat receiving section provided on at least one of said semiconductor devices, a heat dissipation section integrally connected to said wall so as to be thermally connected to said second box, and at least one thermal transport conduit connecting said heat receiving section and said heat dissipation section to each other and transporting heat therebetween.