초록 ▼

A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass theret

A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass therethrough, a nozzle forming body provided adjacent at least one side of the solder wave to define a thin space between the nozzle forming body and the cover plate, and a gas feed conduit connected to the nozzle forming body for feeding a gas to the thin space, so that the gas is jetted through the thin space and flows toward the solder wave.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for wave soldering a printed wiring board, comprising:a solder vessel for containing a molten solder;solder ejecting means having a wave nozzle disposed in said solder vessel for upwardly ejecting the molten solder therefrom to form a solder wave thereabove;t

[ What is claimed is:] [1.] An apparatus for wave soldering a printed wiring board, comprising:a solder vessel for containing a molten solder;solder ejecting means having a wave nozzle disposed in said solder vessel for upwardly ejecting the molten solder therefrom to form a solder wave thereabove;transfer means for transferring the printed wiring board along a predetermined path of travel so that the wiring board is contacted with the solder wave during the passage thereof through said path;cover means having a cover plate covering over said vessel, said cover plate having an opening such that the solder wave can pass therethrough;a nozzle forming body provided adjacent at least one side of the solder wave, said nozzle forming body having a first section secured to a lower side of said cover plate to define a gas chamber therebetween and a second section secured to a lower side of said cover plate and extending from said first section toward said opening to define a thin space between said second section and said cover plate, said thin space being in fluid communication with said gas chamber; andgas feed conduit means connected to said first section of said nozzle forming body for feeding a gas to said gas chamber, so that said gas fed to said gas chamber is jetted through said thin space and flows toward the solder wave.