$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Packaging of high power semiconductor lasers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0833548 (1997-04-07)
발명자 / 주소
  • Hall Douglas W.
  • Jakobson Paul A.
  • Sharps Julia Alyson
  • Bartholomew Roger F.
출원인 / 주소
  • Corning Incorporated
대리인 / 주소
    Murphy
인용정보 피인용 횟수 : 40  인용 특허 : 11

초록

A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The packa

대표청구항

[ What is claimed is:] [1.] A method for packaging a high power GaAs substrate semiconductor laser in a container, said laser having a facet structure and said method comprising:(a) fixedly positioning said laser in said container;(b) introducing into said container a getter for adsorbing or absorbi

이 특허에 인용된 특허 (11)

  1. Wolter Joachim H. (Eindhoven NLX) Horstman Robert E. (Eindhoven NLX), Device for producing or amplifying coherent radiation.
  2. Val, Christian, Electronic component package comprising a moisture-retention element.
  3. Gasser Marcel (Zurich CHX) Latta Ernst E. (Adliswil CHX), Method for mirror passivation of semiconductor laser diodes.
  4. Lachman Irwin M. (Corning NY) Nordlie Lawrence A. (Corning NY), Method of producing high-strength high surface area catalyst supports.
  5. Jakobson Paul A. (Corning NY), Packaging of high power semiconductor lasers.
  6. Jakobson Paul A. (Corning NY), Packaging of high power semiconductor lasers.
  7. Tihanyi Peter (Palo Alto CA) Bauer Robert S. (Portola CA), Passivation for surfaces and interfaces of semiconductor laser facets or the like.
  8. Tihanyi Peter (Palo Alto CA) Bauer Robert S. (Portola CA), Passivation for surfaces and interfaces of semiconductor laser facets or the like.
  9. Nelson Sidney G. (Hudson OH) Nelson Brian W. (Kent OH), Process for NOx and CO control.
  10. Butt Sheldon H. (Godfrey IL) Cherukuri Satyam C. (West Haven CT), Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and wa.
  11. Cameron Keith H. (Felixstowe GB2) Wyatt Richard (Felixstowe GB2) Mellis John (Colchester GB2) Al-Chalabi Salah A. (Ipswich GB2) Brain Michael C. (Ipswich GB2), Semiconductor device and piezoelectric stack optical mounting assembly.

이 특허를 인용한 특허 (40)

  1. Takeshi Aikiyo JP, Airtight sealing method and airtight sealing apparatus for semiconductor laser element.
  2. Trisnadi, Jahja I.; Carlisle, Clinton B., Apparatus for selectively blocking WDM channels.
  3. Maheshwari,Dinesh, Arbitrary phase profile for better equalization in dynamic gain equalizer.
  4. Maheshwari, Dinesh; Trisnadi, Jahia; Corrigan, Robert W., Chirped optical MEM device.
  5. Maheshwari, Dinesh, Diffractive light modulator with dynamically rotatable diffraction plane.
  6. Tomita,Akira; Amm,David Thomas; Daneman,Michael J.; Hunter,James; Staker,Bryan, High contrast grating light valve type device.
  7. Maheshwari,Dinesh, High contrast tilting ribbon blazed grating.
  8. Hunter, James A., Integrated driver process flow.
  9. Amiotti, Marco; Petersen, Ronald O., Integrated getter for vacuum or inert gas packaged LEDs.
  10. Vorndran, Kenneth R.; Olmsted, Brian L.; Balonek, Daniel J., Laser module and system.
  11. Trisnadi,Jahja I.; Carlisle,Clinton B., MEMS interferometer-based reconfigurable optical add-and-drop multiplexor.
  12. de Groot, Wilhelmus; Maheshwari, Dinesh, Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices.
  13. Trisnadi, Jahja I., Method and apparatus for reducing laser speckle using polarization averaging.
  14. Whitney, Peter S.; Flanders, Dale C., Method and system for avoiding package induced failure in swept semiconductor source.
  15. Whitney, Peter S.; Flanders, Dale C., Method and system for avoiding package induced failure in swept semiconductor source.
  16. Zolnowski, Dennis Ronald, Method for hermetic leadless device interconnect using a submount.
  17. Shook, James Gill, Method of and apparatus for sealing an hermetic lid to a semiconductor die.
  18. Leung, Omar S., Method of sealing a hermetic lid to a semiconductor die at an angle.
  19. Hunter,Jim; Amm,David; Gudeman,Christopher, Micro-structures with individually addressable ribbon pairs.
  20. Gudeman, Christopher; Hunter, James; Yeh, Richard; Amm, David T., Micro-support structures.
  21. Bruner, Mike, Microelectronic mechanical system and methods.
  22. Bruner,Mike, Microelectronic mechanical system and methods.
  23. Tsuda, Yuhzoh; Hanaoka, Daisuke; Ishida, Masaya, Nitride semiconductor laser device.
  24. Ito, Shigetoshi; Takatani, Kunihiro; Omi, Susumu, Nitride semiconductor laser device and nitride semiconductor laser apparatus.
  25. Murata Hideaki,JPX ; Aikiyo Takeshi,JPX ; Ono Kazuto,JPX ; Sakata Masato,JPX ; Kazama Yukio,JPX, Optical module package and method for manufacturing the same.
  26. Watanabe, Tohru; Higashi, Toshio; Komiyama, Manabu; Yamane, Takashi, Optical semiconductor device.
  27. Dueweke, Michael; Maheshwari, Dinesh; Gudernan, Christopher; Trisnadi, Jahja I., Patterned diffractive light modulator ribbon for PDL reduction.
  28. Carlisle, Clinton B.; Trisnadi, Jahja I., Rapidly tunable external cavity laser.
  29. Trisnadi,Jahja I.; Carlisle,Clinton B., Reconfigurable modulator-based optical add-and-drop multiplexer.
  30. Hunter, James; Staker, Bryan, Reduced formation of asperities in contact micro-structures.
  31. Alexander Payne ; Christopher Gudeman ; James Hunter ; Michael Bruner ; Clinton Carroll, Reduced surface charging in silicon-based devices.
  32. Payne, Alexander; Gudeman, Christopher; Hunter, James; Bruner, Michael; Carroll, Clinton, Reduced surface charging in silicon-based devices.
  33. Tsunetomo, Kohei; Tsukiji, Naoki; Yoshida, Junji; Hayamizu, Naoki; Koseki, Takashi, Semiconductor laser module, optical measuring method and optical measuring apparatus.
  34. Serbicki, Jeffrey P.; Tuller, Jeffrey D., Shock resistant laser module.
  35. Serbicki, Jeffrey P.; Tuller, Jeffrey D., Shock resistant laser module.
  36. Wakelin,Suzanne, System and method for gettering gas-phase contaminants within a sealed enclosure.
  37. Weiller, Bruce H.; Fowler, Jesse D.; Villahermosa, Randy M., Systems and methods for inhibiting contamination enhanced laser induced damage (CELID) based on fluorinated self-assembled monolayers disposed on optics.
  38. Weiller, Bruce H.; Villahermosa, Randy M.; Fowler, Jesse D., Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives.
  39. Weiller, Bruce H.; Villahermosa, Randy M.; Fowler, Jesse D., Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives.
  40. Corrigan,Robert W.; Maheshwari,Dinesh, Two-stage gain equalizer.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로