[특허]Encapsulated transducer and method of manufacture

Encapsulated transducer and method of manufacture 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01B-007/14 G01H-011/02 G01R-003/00 B29C-045/00
출원번호	US-0542534 (1995-10-13)
발명자 / 주소	Van Den Berg Dave
출원인 / 주소	Bently Nevada Corporation
대리인 / 주소	Kreten
인용정보	피인용 횟수 : 11 인용 특허 : 33

초록 ▼

The encapsulated transducer (10) includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) ensconces a sensing element (40) proximate the front end (22) and a portion of a cable (60) which extends from the back end (24). The sensing element or coil (40) is electrically and mechanically connected to the cable (60) by a pair of suitably sized front and rear ferrules (80), (90) secured to a center and coaxial conductor (66), (70) of the associated cable (60) thereby forming a coil and cable assembly (110). At least the rear ferrule (90) includes a shoulder (100) for firmly anchoring the coil and cable assembly (110) within the encapsulation (20). In addition an injection molding process provides the durable encapsulation (20) which bonds with a dielectric (68) of the cable (60) and symmetrically locks the coil and cable assembly (110) therein.

대표청구항 ▼

[ I claim:] [1.] A transducer for monitoring the status of rotating equipment, comprising in combination:an air core coil sensing element having a hollow interior;first and second leads extending from said sensing element;a cable operatively coupled to said leads, anda monolith of cured moldable material defining a unitary mass ensconcing both said interior and an exterior of said sensing element, leads and a portion of said cable defining a seamless mass totally enveloping said sensing element, leads and a portion of said cable.

이 특허에 인용된 특허 (33)

Geithman Glenn A. (Renton WA) Chau Albert W. (Redmond WA), Aluminum cladding thickness measurement probe and instrument having an automatic calibration and readout circuit coupled.
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Dickie Robert G. (Newmarket CAX) Phillips Michael (Mississauga CAX), Apparatus for plastic injection overmolding.
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Van Den Berg David (Markleeville CA) Peterson Eric C. (Minden NV) Saarem David M. (Minden NV) De Lange Dennis D. (Gardnerville NV), Cable locking and sealing process for sensor.
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Buchschmid Emil (Rosstal DEX) Ebenhh Erich (Ansbach DEX) Moog Michael (Leinfelden-Echterdingen DEX) Huber Werner (Schwaikhaim DEX) Stritzel Berthold (Ansbach DEX), Cable supporting insert closing an opening in the housing of an inductive rotational speed sensor.
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Hermle Eduard (Kirchstrasse 20 D-7303 Neuhausen a.d.Fildern DEX), Electric proximity sensor.
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Forster Joachim (Winnenden DEX), Encapsulated apparatus.
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Plunkett James P. (West Dundee IL) Latchford Joseph T. (Bowmanville CA), Encapsulated coil and method of making the same.
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Byrne John R. (Watertown WI), Floating insert injection mold.
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Lavallee Gerald A. (Belchertown MA) Jarmuzewski Mario R. (Chicopee MA), Golf ball injection mold.
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Dickmeyer David A. (Fort Wayne IN) Maurer ; III Kenneth G. (Fort Wayne IN) Redmon Larry L. (Fort Wayne IN), High output and environmentally impervious variable reluctance sensor.
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Mehnert Wolfgang (Lindau-Reutin DEX), Housing for electronic switchgear.
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Goll Manfred (Glauburg DEX) Wehner Erkenbert (Frankfurt am Main DEX), Induction generator.
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Fay John E. (Leominster MA) Faulkner Michael T. (Leominster MA), Injection molding mechanism for forming a monolithic tubular pipette.
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Ormson Timothy J. (2131 Woodruff Blvd. Janesville WI 53545), Kitchen tools and method of preparation.
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Togo Ichiro (Himeji JPX), Magnetic pickup sensor.
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Pierpont, Ralph E., Method for encapsulating a radial leaded electrical component.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Yokoyama Takaaki (Niiza JPX), Method for manufacturing plastic encapsulated electronic semiconductor devices.
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Kilgore David C. (Yorktown VA), Method of making a hermetically sealed overmolded free-standing solenoid coil.
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Schutts Mark E. (Reno NV), Method of making a proximity sensor.
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Yokoyama Takaaki (Niiza JPX), Mold assembly.
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Sano Takezo (Shiga JPX) Tsuruyoshi Kenichi (Kusatsu JPX), Molding apparatus with retractable preform support pins.
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Shead Terence H. C. (Chorley Wood EN) Wills David G. (St. Albans EN), Moulding.
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Kohen Isak (Rillieux la Pape FRX), Pickup having encapsulated electrical and magnetic elements.
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Prox Rolf (Mettmann DEX), Proximity sensing head.
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Schutts Mark E. (Reno NV), Proximity sensor resistant to axial and torsional forces.
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Bernardon Edward (Bedford MA) Foley Michael F. (Cambridge MA), Reconfigurable fiber-forming resin transfer system.
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Miyamoto Mitsugu (Chigasaki JPX) Togashi Minoru (Chigasaki JPX) Takahashi Fumio (Yokohama JPX) Fukuoka Yutaka (Tokyo JPX), Resin-seal apparatus for semiconductor element.
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Shaw, Clifford O., Resonant probe and radio frequency coupler.
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Giza John (10 Morningside Ave. Acushnet MA 02743), Retractable pin for an injection mold.
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Giza John P. (Acushnet MA), Retractable pin mold.
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Guichard Robert Charles (Normal IL), Shielding arrangement for sensing the proximity of a metallic object.
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Echasseriau Gilbert (Toulouse FRX) Oliveau Patrice (Toulouse FRX), Variable reluctance electromagnetic sensor with pole piece-magnet assembly locking mechanism and method of assembly.
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Nikkels Robert ; Van den Berg Dave, Apparatus and method for precluding fluid wicking.
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Van Den Berg, David C.; Eldridge, Thomas; Evans, Robert Scott, Cable and method for precluding fluid wicking.
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Perriard,Jacques, Eddy current sensor and sensor coil for the same.
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Rose, Robert Ivan, Method of making a proximity probe.
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Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
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Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
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IPC	Description
A	생활필수품
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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Encapsulated transducer and method of manufacture 원문보기