$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for breaking brittle materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05B-012/00
  • B05B-012/04
  • C03C-017/23
출원번호 US-0573471 (1995-12-15)
발명자 / 주소
  • Allaire Roger A.
  • Menegus Harry E.
  • Raeder Bruce H.
  • Stevens Harrie J.
출원인 / 주소
  • Corning Incorporated
대리인 / 주소
    Carlson
인용정보 피인용 횟수 : 154  인용 특허 : 2

초록

A glass breaking system is provided for breaking large sheets of glass into small sheets, in which a laser beam having an elongated beam spot shape, with a largest dimension which is at least 20 mm, more preferably at least 30 mm, and most preferably at least 40 mm, is moved across a glass sheet to

대표청구항

[ What is claimed is:] [1.] A method for separating flat glass sheets comprising:moving a laser beam across a glass sheet having a thickness of 2 mm or less to draw a crack across said sheet, said laser beam moving in a direction of travel and having an elongated beam spot where it impinges on said

이 특허에 인용된 특허 (2)

  1. Morgan George M. (Fairfield IA) Hinkens Dale R. (Fairfield IA), Method of cutting glass with a laser and an article made therewith.
  2. Karube Norio (Machida JPX), Method of cutting workpiece with laser beam.

이 특허를 인용한 특허 (154)

  1. Hoekstra Brian L., Apparatus for separating non-metallic substrates.
  2. Greenberg, Robert S.; Gentry, Carol M., Catheter hub attachment assembly.
  3. Xuan, Jialuo Jack; Shih, Chung-Yuang, Combined laser-scribing and laser-breaking for shaping of brittle substrates.
  4. Allaire Roger A. ; Brown James W., Control of median crack depth in laser scoring.
  5. Bankaitis, Jonas; Uhlig, Kevin William, Edge chamfering by mechanically processing laser cut glass.
  6. Li, Xinghua, Edge-protected product and finishing method.
  7. Burdette, Steven Roy; He, Longting; Klingensmith, Lewis Kirk; Wang, Liming, Forming glass sheets with improved shape stability.
  8. Richard Lionel Silas CA, Glass bending process.
  9. West, James Andrew, Glass cutting systems and methods using non-diffracting laser beams.
  10. Bhuyan, Manoj K.; Jedrkiewicz, Ottavia; Di Trapani, Paolo; Sabonis, Vytautas; Mikutis, Mindaugas, High speed laser processing of transparent materials.
  11. Tamura, Yutaka, High speed laser scribing method of fragile material.
  12. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser beam machining method.
  13. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser beam machining method.
  14. Fukumitsu, Kenshi, Laser beam machining method, laser beam machining apparatus, and laser beam machining product.
  15. Fukumitsu, Kenshi, Laser beam machining method, laser beam machining apparatus, and laser beam machining product.
  16. John S. Kresge, Laser beam system for micro via formation.
  17. Bookbinder, Dana Craig; Logunov, Stephan Lvovich; Marjanovic, Sasha; Nieber, Albert Roth; Piech, Garrett Andrew; Reddy, Kamjula Pattabhirami; Tandon, Pushkar; Tsuda, Sergio; Venkataraman, Natesan; Wagner, Robert Stephen, Laser cut composite glass article and method of cutting.
  18. Bookbinder, Dana Craig; Logunov, Stephan Lvovich; Marjanovic, Sasha; Nieber, Albert Roth; Piech, Garrett Andrew; Reddy, Kamjula Pattabhirami; Tandon, Pushkar; Tsuda, Sergio; Venkataraman, Natesan; Wagner, Robert Stephen, Laser cut composite glass article and method of cutting.
  19. Choo, Dae-ho; Kim, Byeong-ill; Jung, Sung-uk; Lee, Woo-shik; Kim, Bum-soo, Laser cutter apparatus using two laser beams of different wavelengths.
  20. Choo, Dae-ho; Kim, Byeong-ill; Jung, Sung-uk; Lee, Woo-shik; Kim, Bum-soo, Laser cutting apparatus and method.
  21. Dae-ho Choo KR; Byeong-ill Kim KR; Sung-uk Jung KR; Woo-shik Lee KR; Bum-soo Kim KR, Laser cutting apparatus and method.
  22. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser cutting by forming a modified region within an object and generating fractures.
  23. Garner, Sean Matthew; Li, Xinghua, Laser cutting method.
  24. Marjanovic, Sasha; Nieber, Albert Roth; Piech, Garrett Andrew; Schillinger, Helmut; Tsuda, Sergio; Wagner, Robert Stephen, Laser cutting of display glass compositions.
  25. Abramov, Anatoli Anatolyevich; Sun, Yawei, Laser cutting of glass along a predetermined line.
  26. N'Gom, Moussa; Piech, Garrett Andrew; Watkins, James Joseph; Wieland, Kristopher Allen; Wilcox, Chad Michael, Laser cutting of thermally tempered substrates.
  27. Tanaka, Koichiro, Laser irradiation stage, laser irradiation optical system, laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device.
  28. Hayashi Kenichi,JPX, Laser marking method and apparatus, and marked member.
  29. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki, Laser processing method.
  30. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  31. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  32. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Laser processing method.
  33. Atsumi, Kazuhiro; Kuno, Koji; Kusunoki, Masayoshi; Suzuki, Tatsuya, Laser processing method and device.
  34. Atsumi, Kazuhiro; Kuno, Koji; Kusunoki, Masayoshi; Suzuki, Tatsuya, Laser processing method and device.
  35. Atsumi, Kazuhiro; Kuno, Koji; Kusunoki, Masayoshi; Suzuki, Tatsuya; Fukumitsu, Kenshi; Fukuyo, Fumitsugu, Laser processing method and device.
  36. Atsumi, Kazuhiro; Kuno, Koji; Kusunoki, Masayoshi; Suzuki, Tatsuya; Fukumitsu, Kenshi; Fukuyo, Fumitsugu, Laser processing method and device.
  37. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  38. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  39. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  40. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  41. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  42. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  43. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Laser processing method and laser processing apparatus.
  44. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser processing method and laser processing apparatus.
  45. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser processing method and laser processing apparatus.
  46. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu; Atsumi, Kazuhiro; Muramatsu, Kenichi, Laser processing method and laser processing apparatus.
  47. Fukuyo,Fumitsugu; Fukumitsu,Kenshi; Uchiyama,Naoki; Wakuda,Toshimitsu, Laser processing method and laser processing apparatus.
  48. Fukuyo,Fumitsugu; Fukumitsu,Kenshi; Uchiyama,Naoki; Wakuda,Toshimitsu, Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object.
  49. Osajima, Tetsuya; Sugiura, Ryuji; Atsumi, Kazuhiro, Laser processing method for forming a modified region for cutting in an object.
  50. Qi, Jun; Fu, Wayne H.; Wang, Chenhui; Lin, Kuanying; Gupta, Nathan K.; Yin, Victor H., Laser processing of display components for electronic devices.
  51. Qi, Jun; Fu, Wayne H.; Wang, Chenhui; Lin, Kuanying; Gupta, Nathan K.; Yin, Victor H., Laser processing of display components for electronic devices.
  52. Marjanovic, Sasha; Piech, Garrett Andrew; Tsuda, Sergio; Wagner, Robert Stephen, Laser processing of sapphire substrate and related applications.
  53. Marjanovic, Sasha; Piech, Garrett Andrew; Tsuda, Sergio; Wagner, Robert Stephen, Laser processing of sapphire substrate and related applications.
  54. Hackert, Thomas; Marjanovic, Sasha; Piech, Garrett Andrew; Tsuda, Sergio; Wagner, Robert Stephen, Laser processing of slots and holes.
  55. Abramov, Anatoli A.; Sun, Yawei; Xu, Wei; Zhou, Naiyue, Laser scoring of glass sheets at high speeds and with low residual stress.
  56. Abramov, Anatoli Anatolyevich; Sun, Yawei; Wu, Qi, Laser scoring with curved trajectory.
  57. Abramov, Anatoli Anatolyevich; Kemmerer, Marvin William; Sun, Yawei; Zhou, Naiyue, Laser separation of glass sheets.
  58. Jialuo Xuan ; Zhengda Pan ; Chung-Yuang Shih ; Thanh Duc Nguyen, Laser-scribing brittle substrates.
  59. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
  60. Hirano, Katsuhiko; Hayashi, Makoto; Enomoto, Kunio; Kitano, Makoto; Kanno, Satoshi, Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate.
  61. Liu, Zhen; Liu, Ming; Ding, Tao; Park, Hyojung, Liquid crystal substrate cutting device and cutting method for liquid crystal substrate.
  62. Higashi, Mitsutoshi; Sakaguchi, Hideaki, Method and apparatus for cutting a semiconductor wafer.
  63. Lu, Hung Cheng (Henry); Xu, Wei; Wang, Liming; Zhou, Naiyue, Method and apparatus for cutting glass ribbon.
  64. Ostendarp Heinrich,DEX ; Hermanns Christoph,DEX ; Hauer Dirk,DEX ; Stein Juergen,DEX ; Geissler Georg,DEX ; Steinfartz Ralf,DEX ; Hoetzel Bernd,DEX ; Blunck Andrew,DEX, Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
  65. Ostendarp Heinrich,DEX ; Hermanns Christoph,DEX ; Hauer Dirk,DEX ; Stein Juergen,DEX ; Geissler Georg,DEX ; Steinfartz Ralf,DEX ; Hoetzel Bernd,DEX ; Blunck Andrew,DEX, Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
  66. Roell, Bernhard, Method and apparatus for producing an elastically deformable glass plate.
  67. Abramov, Anatoli Anatolyevich; Sun, Yawei, Method and apparatus for scoring and separating a brittle material with a single beam of radiation.
  68. Brian Hoekstra ; Roger Flannigan ; Daniel Wegerif, Method and apparatus for separating non-metallic materials.
  69. Hoekstra, Brian; Flannigan, Roger; Wegerif, Daniel, Method and apparatus for separating non-metallic materials.
  70. Hoekstra Brian L. ; Pierola Javier A. ; Kar Aravinda, Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator.
  71. Zhang, Haibin; Shan, Fang; Rekow, Mathew; Zhang, Min; Simenson, Glenn; Xu, Qian; Brookhyser, James; Frankel, Joe; Darwin, Michael; Rundel, Jack; Pysher, Matthew, Method and apparatus for separation of workpieces and articles produced thereby.
  72. Hoetzel, Bernd, Method and device for rapid cutting of a workpiece from a brittle material.
  73. Teranishi, Yasuo; Matsumoto, Yasuhiro; Minari, Taiki; Furuta, Takaya, Method for cutting plate-like glass, and cutting device therefor.
  74. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method for cutting semiconductor substrate.
  75. Luiz,Mauro Lucio Nascimento, Method for cutting the edges of a continuous glass ribbon, a device for implementing said method, and a glass plate cut using said method.
  76. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Method for dicing substrate.
  77. Acker, Stefan; Weisser, Juergen; Ullmann, Ronny, Method for generating optically perceptible laser-induced cracks in brittle material.
  78. Xuan, Jialuo Jack; Shih, Chung-Yuang; Nguyen, Thanh Duc, Method for laser-scribing brittle substrates and apparatus therefor.
  79. Abramov, Anatoli A.; Yu, Jae H.; Zhou, Naiyue, Method for low energy separation of a glass ribbon.
  80. Abramov, Anatoli A.; Yu, Jae H.; Zhou, Naiyue, Method for low energy separation of a glass ribbon.
  81. Hsieh, John; Homola, Andrew; Salamon, David Vigdor; Hodges, Holland; Bajorek, Christopher H., Method for manufacturing a magnetic disk.
  82. Hsieh, John; Homola, Andrew; Salamon, David Vigdor; Hodges, Holland, Method for manufacturing a substantially circular substrate by utilizing scribing.
  83. Marjanovic, Sasha; Piech, Garrett Andrew; Shanmugam, Shyamala; Pons Siepermann, Carlos Alberto; Tsuda, Sergio; Varga, Zsigmond; Wagner, Robert Stephen, Method for rapid laser drilling of holes in glass and products made therefrom.
  84. Marjanovic, Sasha; Piech, Garrett Andrew; Shanmugam, Shyamala; Pons Siepermann, Carlos Alberto; Tsuda, Sergio; Varga, Zsigmond; Wagner, Robert Stephen, Method for rapid laser drilling of holes in glass and products made therefrom.
  85. Abramov, Anatoli Anatolyevich; Cavallaro, III, Nicholas Dominic; Kemmerer, Marvin William; Zhou, Naiyue, Method for scoring a sheet of brittle material.
  86. Cox, Judy Kathleen; Joseph, II, Michael Albert; Morgan, Kenneth Spencer, Method for separating a pane of brittle material from a moving ribbon of material.
  87. Garner, Sean Matthew; Li, Xinghua, Method for separating a sheet of brittle material.
  88. Brian L. Hoekstra, Method for separating non-metallic substrates.
  89. Sawada Hiroshi,JPX, Method of cleaving a brittle material using a point heat source for providing a thermal stress.
  90. Sawada Hiroshi,JPX, Method of cleaving a brittle material using a point heat source for providing a thermal stress.
  91. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate and method of manufacturing a semiconductor device.
  92. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device.
  93. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device.
  94. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of cutting a wafer-like object and semiconductor chip.
  95. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
  96. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting an object to be processed.
  97. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting object to be processed.
  98. Fukuyo, Fumitsugu; Fukumitsu, Kenshi, Method of cutting processed object.
  99. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
  100. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate.
  101. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Sugiura, Ryuji, Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion.
  102. Lee, Hyun-Chul; Park, Jin-Han; Kim, Joon-Hyung; Lim, Won-Kyu; Park, Jae-Seok; Roh, Cheol-Lae; Lee, Yong-Jin, Method of cutting substrate.
  103. Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki; Wakuda, Toshimitsu, Method of manufacturing a semiconductor device formed using a substrate cutting method.
  104. Abramov, Anatoli Anatolyevich; Gomez, Sinue; Tsuda, Sergio, Method of separating strengthened glass.
  105. Abramov, Anatoli Anatolyevich; Treichler, George Davis; Zhou, Naiyue, Methods and apparatus for initiating scoring.
  106. Bookbinder, Dana Craig; Nieber, Albert Roth; Logunov, Stephan Lvovich; Tandon, Pushkar; Tsuda, Sergio, Methods and apparatuses for fabricating glass articles.
  107. Bookbinder, Dana Craig; Nieber, Albert Roth; Logunov, Stephan Lvovich; Tandon, Pushkar; Tsuda, Sergio, Methods and apparatuses for fabricating glass articles.
  108. DiGiovanni, Anthony A., Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools.
  109. Grundmueller, Richard; Herrnberger, Frank Fabian; Klein, Michael; Spaeth, Florian, Methods and apparatuses for laser processing materials.
  110. DiGiovanni, Anthony A.; DiFoggio, Rocco, Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams.
  111. Dannoux, Thierry Luc Alain; Lehuede, Philippe, Methods for cutting a fragile material.
  112. Li, Xinghua; Moore, Lisa Anne, Methods for laser cutting glass substrates.
  113. Li, Xinghua; Moore, Lisa Anne, Methods for laser cutting glass substrates.
  114. Glaesemann, Gregory Scott; Hoff, Kyle C; Li, Xinghua, Methods for laser scribing and breaking thin glass.
  115. Li, Xinghua, Methods for laser scribing and separating glass substrates.
  116. Worrall, III, Joseph A.; Williamson, Alexander S.; McEntee, John F., Methods for producing glass substrates for use in biopolymeric microarrays.
  117. Worrall, III,Joseph A.; Williamson,Alexander S.; McEntee,John F., Methods for producing glass substrates for use in biopolymeric microarrays.
  118. Hassan, Mohd Fadzli A.; Gupta, Nathan K.; Chen, Yu-Cheng, Methods for trimming polarizers in displays.
  119. Hassan, Mohd Fadzli A.; Gupta, Nathan K.; Chen, Yu-Cheng, Methods for trimming polarizers in displays.
  120. Gupta, Nathan K.; Hassan, Mohd Fadzli A.; Lin, Kuan-Ying; Chen, Yu-Cheng, Methods for trimming polarizers in displays using edge protection structures.
  121. Abramov, Anatoli Anatolyevich; Zhou, Naiyue, Methods of cutting glass using a laser.
  122. Stockey, David A.; DiGiovanni, Anthony A., Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts.
  123. Stockey, David A.; DiGiovanni, Anthony A., Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts.
  124. Li, Xinghua, Methods of separating strengthened glass substrates.
  125. Garner, Sean Matthew; Li, Xinghua, Non-contact glass shearing device and method for scribing or cutting a moving glass sheet.
  126. Koyanagi, Tasuku; Morikazu, Hiroshi, Optical device wafer processing method.
  127. Koyanagi, Tasuku; Morikazu, Hiroshi, Optical device wafer processing method.
  128. Abramov, Anatoli Anatolyevich; Wu, Qi; Zhou, Naiyue, Precision laser scoring.
  129. Brown, James W; Menegus, Harry E, Process and apparatus for scoring a brittle material.
  130. Yoshino Takashi,JPX ; Kato Kenji,JPX ; Imaeda Minoru,JPX, Process for working a preform made of an oxide single crystal, and a process for producing functional devices.
  131. Marjanovic, Sasha; Nieber, Albert Roth; Piech, Garrett Andrew; Tsuda, Sergio; Wagner, Robert Stephen, Processing 3D shaped transparent brittle substrate.
  132. Abramov, Anatoli Anatolyevich; Ukrainczyk, Ljerka; Wu, Qi; Zhou, Naiyue, Scoring of non-flat materials.
  133. Masato Matsumoto JP, Scribing with laser.
  134. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Semiconductor chip manufacturing method.
  135. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki; Sugiura, Ryuji; Atsumi, Kazuhiro, Semiconductor substrate cutting method.
  136. Fukumitsu, Kenshi; Fukuyo, Fumitsugu; Uchiyama, Naoki; Sugiura, Ryuji; Atsumi, Kazuhiro, Semiconductor substrate cutting method.
  137. Hoppe, Bernd; Haselhorst, Georg; Seibert, Volker, Shaped glass article having a predefined geometry produced without using a mold, method and use of the same.
  138. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  139. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  140. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  141. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  142. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  143. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  144. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  145. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  146. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  147. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  148. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  149. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  150. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  151. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  152. Fujii, Yoshimaro; Fukuyo, Fumitsugu; Fukumitsu, Kenshi; Uchiyama, Naoki, Substrate dividing method.
  153. Bookbinder, Dana Craig; Klingensmith, Lewis Kirk; Logunov, Stephan Lvovich; Nieber, Albert Roth; Schillinger, Helmut; Tandon, Pushkar; Tsuda, Sergio, Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles.
  154. Marjanovic, Sasha; Piech, Garrett Andrew; Tsuda, Sergio; Wagner, Robert Stephen, Transparent material cutting with ultrafast laser and beam optics.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로