초록 ▼

A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-r

A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer, a second oxygen-rich copper base layer joined to the second beryllium oxide layer, and a heat exchanger structure direct bonded to the second base layer. The structure has a plurality of oxygen-rich copper fins stacked upon one another, each fin having a channel at a selected location therein. The material to material interfaces between adjacent stacked fins are joined to one another by direct bonding so as to form a solidified block structure. Each of the channels form a cooling chamber for receiving a fluid flow.

대표청구항 ▼

[ What is claimed is:] [1.] A heat exchanger assembly, which comprises;a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide;a first oxygen-rich copper layer joined to the first beryllium oxide layer;a second beryllium oxide layer joined to the first oxygen-rich copper

[ What is claimed is:] [1.] A heat exchanger assembly, which comprises;a first base layer of oxygen-rich copper joined to a first layer of beryllium oxide;a first oxygen-rich copper layer joined to the first beryllium oxide layer;a second beryllium oxide layer joined to the first oxygen-rich copper layer;a second oxygen-rich copper layer joined to the second beryllium oxide layer;a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer; anda heat exchanger structure joined to the second base layer, the structure comprising a plurality of oxygen-rich copper fins stacked upon one another, each of the fins having a channel at a selected location therein, and material to material interfaces between adjacent stacked fins being joined to one another so as to form a solidified block structure, each channel forming a cooling chamber.