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Multichip module having a cover wtih support pillar 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0812859 (1997-03-06)
발명자 / 주소
  • Tokuno Kenichi,JPX
  • Dohya Akihiro,JPX
출원인 / 주소
  • NEC Corporation, JPX
대리인 / 주소
    Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
인용정보 피인용 횟수 : 41  인용 특허 : 11

초록 ▼

A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern o

대표청구항 ▼

[ What is claimed is:] [1.] A device comprising:a substrate having a plurality of circuit chips fixed in a predetermined pattern of locations on a side of said substrate, each of said circuit chips being electrically connected to electrodes of said substrate;a cover for covering said circuit chips,

이 특허에 인용된 특허 (11)

  1. Samarov Victor M. (36 Russell St. Carlisle MA 01741) DeCarolis Joseph A. (117 West St. Lunenburg MA 01462) Patel Raoji (90 Flanagan Dr. Framingham MA 01701) Piche Gerald J. (54 Clark Rd. Milford NH 0, Coplanar heatsink and electronics assembly.
    상세보기
  2. Joiner ; Jr. Bennett A. (Austin TX), Drop-in heat sink package with window frame flag.
    상세보기
  3. Satoh Ryohei (Yokohama JPX) Oshima Muneo (Yokohama JPX) Tanaka Minoru (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX) Murata Akira (Tokyo JPX) Hirota Kazuo (Chigasaki JPX), Electronic circuit device and method of producing the same.
    상세보기
  4. Anschel Morris (Binghamton NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with heat spreader member.
    상세보기
  5. Suzuki Masakazu (Kawasaki JPX), Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted.
    상세보기
  6. Patel Chandrakant (Fremont CA), Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate.
    상세보기
  7. Murphy William S. (Kokomo IN) King David A. (Kokomo IN), Heat sinking assembly for electrical components.
    상세보기
  8. Rajeevakumar Thekkemadathil V. (Scarsdale NY), High capacity DRAM trench capacitor and methods of fabricating same.
    상세보기
  9. Chia Chok J. (Campbell CA) Alagaratnam Manian (Cupertino CA) Low Qwai H. (Cupertino CA) Lim Seng-Sooi (San Jose CA), High power dissipating packages with matched heatspreader heatsink assemblies.
    상세보기
  10. Call Anson J. (Holmes NY) Meisner Stephen H. (Hudson NY) Pompeo Frank L. (Walden NY) Zitz Jeffrey A. (Poughkeepsie NY), Method for directly joining a chip to a heat sink.
    상세보기
  11. Berg William E. (Portland OR), Mounting an integrated circuit chip to an etched circuit board.
    상세보기

이 특허를 인용한 특허 (41)

  1. Toy Hilton T. ; Sherif Raed A., Apparatus for controlling thermal interface gap distance.
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  2. Jeffrey T. Coffin ; Michael J. Ellsworth, Jr. ; Lewis S. Goldmann ; John G. Torok, Capping structure for electronics package undergoing compressive socket actuation.
    상세보기
  3. Danello, Paul A.; Stander, Richard A.; Goulet, Michael D., Conduction cooling of multi-channel flip chip based panel array circuits.
    상세보기
  4. Gaynes, Michael Anthony; Johnson, Eric Arthur, Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses.
    상세보기
  5. Gaynes, Michael Anthony; Johnson, Eric Arthur, Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses.
    상세보기
  6. Hatanaka, Hidefumi; Taniguchi, Tomohiko, Electronic component module and radio comunications equipment.
    상세보기
  7. Schwarz, Marcos Guilherme, Electronic device.
    상세보기
  8. Caletka, David V.; Johnson, Eric A., Electronic package and method of forming.
    상세보기
  9. Caletka, David V.; Johnson, Eric A., Electronic package and method of forming.
    상세보기
  10. Chiu,Chia Pin, Embedded heat spreader for folded stacked chip-scale package.
    상세보기
  11. Nichols,Randolph G., Environmentally tuned circuit card assembly and method for manufacturing the same.
    상세보기
  12. Donald S. Farquhar ; David E. Houser ; Konstantinos I. Papathomas, Flip chip package with improved cap design and process for making thereof.
    상세보기
  13. Onishi Yukihiro,JPX, Heat-dissipating structure of an electronic part.
    상세보기
  14. Ahuja, Sandeep; Buddrius, Eric W.; Flynn, Roger D.; Agarwal, Rajat, Integrated heat spreader that maximizes heat transfer from a multi-chip package.
    상세보기
  15. Morris, Terrel L., Lossy RF shield for integrated circuits.
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  16. Burton, David Robert; Hardaker, Trevor; Stephens, Matthew; Blythe, Greg; Lockwood, Chris, Media content device chassis with internal extension members.
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  17. Burton, David Robert; Hardaker, Trevor; Stephens, Matthew; Blythe, Greg; Lockwood, Chris, Media content device chassis with internal extension members.
    상세보기
  18. Zhao, Sam Z.; Khan, Reza ur R., Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features.
    상세보기
  19. Frank Louis Pompeo ; Alain A. Caron CA; Jeffrey Thomas Coffin ; Jeffrey Allen Zitz, Method for direct attachment of a chip to a cooling member.
    상세보기
  20. Jimarez, Lisa J.; Jimarez, Miguel A., Method of forming a chip assembly.
    상세보기
  21. Suitou, Ken; Kinoshita, Yusuke; Yamaguchi, Tsuyoshi, Motor driven compressor.
    상세보기
  22. Griffin Curtis M. ; Rollman Jeffrey A. ; Boucher Edmund B., Mounting multiple substrate frame and leadless surface mountable assembly using same.
    상세보기
  23. Janak, Christopher; Capezza, Steve; Jaggers, Christopher M; McAfee, David A; Merrikh, Ali Akbar; Grossman, Matthew; Poteracki, Nicholas; West, Jefferson; Hughes, Paul, Multi-compartment computing device with shared cooling device.
    상세보기
  24. Sorgo, Miksa de, Non-electrically conductive thermal dissipator for electronic components.
    상세보기
  25. Mouri, Morihiko; Okuma, Sadayuki; Takahashi, Yasushi; Ono, Takao; Sakaguchi, Yosihiro; Nakamura, Atsushi; Miyazawa, Toshio, Package for mounting semiconductor device.
    상세보기
  26. Gebauer, Uta; Strutz, Volker, Protective device with spacer for subassemblies.
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  27. Petersen Kurt H. ; Harper David L., Protective enclosure for a multi-chip module.
    상세보기
  28. Syri, Erich; Gruendler, Gerold; Hoegerl, Juergen; Killer, Thomas; Strutz, Volker, Semiconductor module including semiconductor chips in a plastic housing in separate regions.
    상세보기
  29. Ma, Qing; Maveety, Jim; Tran, Quan, Structure and process for reducing die corner and edge stresses in microelectronic packages.
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  30. Ma, Qing; Maveety, Jim; Tran, Quan, Structure for reducing die corner and edge stresses in microelectronic packages.
    상세보기
  31. Jondrow Timothy J., Thermal dissipation and EMI shielding structure for notebook computers.
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  32. Pinneo, John M., Thermal management components.
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  33. Refai Ahmed,Gamal; Wiley,Robert A.; Loro,Jim E., Thermal management device for multiple heat producing devices.
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  34. Refai-Ahmed, Gamal; Wiley, Robert A.; Loro, Jim E., Thermal management device for multiple heat producing devices.
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  35. David L. Edwards ; Glenn G. Daves ; Shaji Farooq ; Sushumna Iruvanti ; Frank L. Pompeo, Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.
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  36. Edwards David L. ; Daves Glenn G. ; Farooq Shaji ; Iruvanti Sushumna ; Pompeo Frank L., Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.
    상세보기
  37. Morishige, Yukio; Omiya, Makoto, Thin film forming equipment and method.
    상세보기
  38. Yukio Morishige JP; Makoto Omiya JP, Thin film forming equipment and method.
    상세보기
  39. Johnson Eric A. ; Park Seungbae, Warpage compensating heat spreader.
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  40. Mikado, Yukinobu; Tomikawa, Mitsuhiro; Tanaka, Yusuke; Furutani, Toshiki, Wiring board and method for manufacturing the same.
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  41. Mikado, Yukinobu; Tomikawa, Mitsuhiro; Tanaka, Yusuke; Furutani, Toshiki, Wiring board and method for manufacturing the same.
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