초록 ▼

The ignition coil driver module of the present invention includes a control integrated circuit and a high current load driver integrated circuit housed within a common package such as a TO-247 or TO-264 package. The control integrated circuit is formed of a semiconductor material manufactured in acc

The ignition coil driver module of the present invention includes a control integrated circuit and a high current load driver integrated circuit housed within a common package such as a TO-247 or TO-264 package. The control integrated circuit is formed of a semiconductor material manufactured in accordance with a standard low-voltage integrated circuit processing technology and is responsive to a control signal input to provide a low voltage drive signal. The high current load driver integrated circuit is formed of a semiconductor material manufactured in accordance with a high-voltage integrated circuit processing technology and is responsive to the low voltage drive signal to energize the high current load. A current limit function is further provided for limiting the load current to a predetermined level.

대표청구항 ▼

[ The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] A high current load driver module comprising:a control circuit responsive to a low voltage control signal to provide a low voltage drive signal, said control circuit formed of a lo

[ The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] A high current load driver module comprising:a control circuit responsive to a low voltage control signal to provide a low voltage drive signal, said control circuit formed of a low voltage semiconductor material arranged as a first integrated circuit;a high current load driver circuit responsive to said low voltage drive signal to energize a high current load, said high current load driver circuit formed of a high voltage semiconductor material arranged as a second integrated circuit separate from said first integrated circuit; anda housing having a first terminal extending therein and forming an integrated circuit mount within said housing, said first integrated circuit having a substrate attached to said mount yet electrically insulated therefrom via an electrically insulating circuit mount medium separate from said integrated circuit mount, said second integrated circuit having a substrate attached and electrically connected to said mount via an electrically conductive circuit mount medium separate from said integrated circuit mount.