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Heat dissipating lid hinge structure with laterally offset heat pipe end portions 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
  • F28D-015/02
출원번호 US-0769795 (1996-12-19)
발명자 / 주소
  • Mecredy
  • III Henry E.
출원인 / 주소
  • Compaq Computer Corporation
대리인 / 주소
    Konneker & Smith, P.C.
인용정보 피인용 횟수 : 52  인용 특허 : 5

초록

A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermo

대표청구항

[ What is claimed is:] [6.] A heat dissipating hinge structure comprising:a first heat pipe having an end portion extending along an axis and defining a first hinge structure section;a second hinge structure section formed of a heat conductive material, said second hinge structure section rotatably

이 특허에 인용된 특허 (5)

  1. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  2. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  3. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  4. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  5. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (52)

  1. Robert L. McMahan ; Damon W. Broder, Apparatus and method for cooling a heat generating component in a computer.
  2. Susan A. Yeager ; Rakesh Bhatia, Apparatus and method for mounting a heat generating component in a computer system.
  3. Shigeru Ishii JP; Shigeki Mori JP; Hirokazu Nishimura JP; Shinji Nakai JP, Cable and heat sink.
  4. Sagal, E. Mikhail, Capacitor post with improved thermal conductivity.
  5. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX, Cooler for electronic devices.
  6. Mochizuki Masataka,JPX ; Mashiko Koichi,JPX ; Goto Kazuhiko,JPX ; Saito Yuji,JPX ; Eguchi Katsuo,JPX ; Nagaki Yoshihiro,JPX ; Takamiya Akihiro,JPX ; Nguyen Thang Toan,JPX, Cooler for electronic devices.
  7. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  8. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  9. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  10. Suzuki, Masahiro, Cooling system for electronic packages.
  11. Wang, Hwai-Ming; Chiang, Wei-Chieh; Liu, Hsien-Tsang, Cooling system for hinged portable computing device.
  12. Hiroshi Nakamura JP; Chihei Kitahara JP; Kentaro Tomioka JP; Katsuhiko Yamamoto JP, Cooling unit for cooling a heat-generating component in an electronic apparatus.
  13. Matsuoka, Yoshimichi, Disc style 360 degree hinge for a laptop computer.
  14. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
  15. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
  16. Chang, Yao-Ting; Chan, Hung-Chou, Electronic device with heat dissipation apparatus.
  17. Shigeo Ohashi JP; Takashi Naganawa JP; Tadakatsu Nakajima JP; Tsuyoshi Nakagawa JP; Masaaki Eishima JP; Yoshihiro Kondo JP, Electronic equipment.
  18. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  19. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  20. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  21. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  22. Koichi Inoue JP; Chiyoshi Sasaki JP, Heat conducting apparatus and electronic apparatus having the same.
  23. Ali Ihab A. ; Hermerding James ; Bhatia Rakesh, Heat dissipation apparatus and method.
  24. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
  25. Chiyoshi Sasaki JP; Hiroaki Maekawa JP; Junji Sotani JP; Masaru Ohmi JP; Isao Tsukada JP; Toru Arimoto JP, Heat pipe hinge structure for electronic device.
  26. Bhatia Rakesh, Heat pipe with pumping capabilities and use thereof in cooling a device.
  27. Shou Yong Kung,TWX ; Chiang Feng-Yu,TWX, Heat transfer device.
  28. Gold Philip, Heat transfer from base to display portion of a portable computer.
  29. Lee Chuan-Yuan,TWX ; Chang Hui-Lian,TWX ; Yuan Ming,TWX, Heat-dissipating device for an electronic component.
  30. Sun Ming-Shen,TWX ; Lu Shao-Pai,TWX, Heat-dissipating module for an electronic device.
  31. Miller, James D.; Sagal, E. Mikhail; McCullough, Kevin A., Highly thermally conductive electronic connector.
  32. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  33. Matsuoka, Yoshimichi, Hinge for a multiple operating mode computing device.
  34. Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Wong Tin-Lup, Method and system in a data processing system for efficiently cooling a portable computer system.
  35. Sagal, E. Mikhail, Method of making a capacitor post with improved thermal conductivity.
  36. McCullough, Kevin A., Method of manufacturing a structural frame.
  37. Miller,James D.; Sagal,E. Mikhail; McCullough,Kevin A., Molded electronic connector formed from a thermally conductive polymer composition and method of making the same.
  38. Samuels, Bruce Richard John; Timmerman, Mark Andrew; Liu, Edwin Sy, Peripheral device with limited relative angular movement.
  39. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Portable computer rotational heat pipe heat transfer.
  40. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  41. Holung Joseph Anthony ; Wong Tin-Lup ; Kamath Vinod, Quick-release hinge joint for heat pipe.
  42. Couto, Paulo Rogerio Carrara; Ribeiro, Guilherme Borges, Refrigeration system for compact equipment.
  43. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  44. Mohammad A. Tantoush, Scalable and modular heat sink-heat pipe cooling system.
  45. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.
  46. Han, Jake J.; Johnson, Mitchell Kevin, System and method for extracting heat from a printed circuit board assembly.
  47. Rossi,Thomas M.; Pokharna,Himanshu, System to improve display efficiency based on recycling local heat source.
  48. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
  49. Janak G. Patel, Thermal transfer hinge for hinged mobile computing device and method of heat transfer.
  50. Kevin A. McCullough ; E. Mikhail Sagal ; James D. Miller, Thermally conductive electronic device case.
  51. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
  52. Gummin, Mark A., Vacuum feedthrough heatpipe assembly.
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