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Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A61N-013/75
출원번호 US-0632730 (1996-04-15)
발명자 / 주소
  • Hassler Beth Anne
  • Donders Adriannus P.
  • Wiklund Craig L.
  • Lyons Daniel A.
출원인 / 주소
  • Medtronic, Inc.
대리인 / 주소
    Patton
인용정보 피인용 횟수 : 235  인용 특허 : 19

초록

An implantable medical device with a ceramic enclosure has a novel multi-layered ceramic feedthrough substrate in place of a prior art glass-to-metal feedthrough substrate, leading to lower costs and a higher feedthrough density. Use in a metal enclosure is also disclosed.

대표청구항 ▼

[ We claim:] [1.] A packaging arrangement for the outer packaging of an implantable medical device comprising:a ceramic enclosure having an opening for receiving circuitry of said implantable medical device; anda multi-layered feedthrough substrate for coupling to said ceramic enclosure at edges aro

이 특허에 인용된 특허 (19)

  1. Swamy Deepak N. (Austin TX), Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards.
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  2. Nagasaka Takashi (Anjo JPX) Ontani Yuji (Okazaki JPX) Saitou Mitsuhiro (Oobu JPX), Ceramic multi-layer wiring board.
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  3. Kato Naomiki (Aichi JPX) Maruyama Kazuyuki (Aichi JPX), Ceramic-glass IC package assembly having multiple conductive layers.
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  4. Shaheen Joseph M. (La Habra CA), Ceramic/organic multilayer interconnection board.
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  5. Kuzma Janusz (Stanmore AUX), Cochlear prosthetic package.
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  6. Gogal John F. (Lebanon NJ), Double cavity semiconductor chip carrier.
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  7. Byers Charles L. (Canyon Country CA) Beazell James W. (Rancho Palos Verdes CA) Schulman Joseph H. (Granada Hills CA) Rostami Ali (Santa Monica CA), Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies.
    상세보기
  8. Monnier Michel J. (Montgeron FRX), Housing for an electronic device.
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  9. Schulman Joseph H. (Santa Clarita CA) Strojnik Primoz (Granada Hills CA) Meadows Paul (Altadena CA), Implantable microdevice with self-attaching electrodes.
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  10. Weinberg Alvin H. (Miami FL) Jones W. Kinzy (Pembroke Pines FL), Implantable pulse generator having a single printed circuit board and a chip carrier.
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  11. Jones W. Kinzy (Pembroke Pines FL) Weinberg Alvin H. (Miami FL), Implantable pulse generator having a single printed circuit board for carrying integrated circuit chips thereon with chi.
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  12. Schulman Joseph H. (Los Angeles CA), Implantable unipolar pacemaker with improved outer electrode plate.
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  13. Imai Ryuji (Nagoya JPX) Takada Toshikatsu (Nagoya JPX), Input/output terminal for electronic circuit device.
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  14. Daigle Robert C. (Sterling CT) Smith W. David (Abington CT) Olenick John A. (Brockport NY) Arthur David J. (Norwood MA) Swei Gwo S. (Northboro MA), Method of manufacturing a multilayer circuit.
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  15. Mizutani Daisuke (Kawasaki JPX) Yokouchi Kishio (Kawasaki JPX), Multilayer circuit board and a method for fabricating the same.
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  16. Gels Robert G. (Boston MA) Robbins William L. (Newton Center MA), Multilayer miniaturized microstrip antenna.
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  17. Swanson Dale W. (Yorba Linda CA) Licari James J. (Whittier CA), Reverse-engineering resistant encapsulant for microelectric device.
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  18. Fischer David J. (Arden Hills MN), Subcutaneous housing assembly.
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  19. Carlstedt L. Gunnar (Partille SEX), VLSI-chips package with floatingly mounted chip means.
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