초록 ▼

The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and t

The specification describes an interconnection technique using compliant metal coated photodefined polymer bumps for mounting and interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The polymer chosen for the bump structure has a relatively low T.sub.g and the polymer bump is metallized in a way that substantially encapsulates the polymer.

대표청구항 ▼

[ We claim:] [1.] Method for bonding two elements together, said two elements consisting of an electrical or photonic component and a substrate for supporting said component, the method comprising the steps of:a. forming a plurality of bonding pad on the first of said elements,b. depositing a layer

[ We claim:] [1.] Method for bonding two elements together, said two elements consisting of an electrical or photonic component and a substrate for supporting said component, the method comprising the steps of:a. forming a plurality of bonding pad on the first of said elements,b. depositing a layer of photodefinable polymer on the surface of said second element, said photodefinable polymer having a glass transition temperature T.sub.g,c. masking said layer of photodefinable polymer with a mask having a plurality of actinic light transparent features corresponding to a plurality of bumps,d. exposing said masked photodefinable layer to actinic light,e. developing said photodefinable layer to produce a plurality of bump features on the surface of said second element, each of said plurality of bump features having a to p surface and sidewall surfaces exposed by the developing step e.,f. coating the top surface and the sidewall surfaces of each of said bumps with a metal coating so that the polymer bump is substantially completely encased in said metal coating,g. positioning the said plurality of bumps in registration with said plurality of bonding pads,h. providing a layer of anisotropic conductive film between the plurality of bonding pads and the plurality of bumps,i. urging said first and second elements together,j. heating said first and second elements to a bonding temperature, while applying pressure to said elements to bond said plurality of bumps to said plurality of bonding pads.