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Electrically conductive thermal interface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/34
출원번호 US-0938282 (1997-09-26)
발명자 / 주소
  • Deeney Jeffrey L.
출원인 / 주소
  • Hewlett-Packard Co.
대리인 / 주소
    Neudeck
인용정보 피인용 횟수 : 40  인용 특허 : 21

초록 ▼

A thermal interface 26 between a heat source (e.g., an IC die) 24 and a heat sink 28 comprises a metallic mesh (26a) filled with a thermally conductive semi-liquid substance (26b). The thermally conductive semi-liquid substance may comprise, e.g., silicone grease or paraffin. The wire mesh may compr

대표청구항 ▼

[ What is claimed is:] [1.] A thermal and electrical interface for conducting heat and electricity which may be non-destructively assembled and disassembled, comprising:a first member;a second member; anda woven mesh screen, said woven mesh screen being comprised of metal wires, said metal wires bei

이 특허에 인용된 특허 (21)

  1. Cutchaw John M. (7333 E. Virginia Ave. Scottsdale AZ 85257), Apparatus for cooling high-density integrated circuit packages.
    상세보기
  2. Lebailly Michel (Bollene FRX) Taverdet Jean-Claude (Issirac FRX), Carrier for a card carrying electronic components and of low heat resistance.
    상세보기
  3. Ruka Roswell J. (Pittsburgh PA) Charles Robert G. (Allison Park PA), Heat sink.
    상세보기
  4. Peck Wayne P. (St. Petersburg FL), Heat transfer device.
    상세보기
  5. Okada Ryoji (Shimoinayoshi JPX) Sato Motohiro (Minori JPX) Yamada Toshihiro (Tomobe JPX) Kuwabara Heikichi (Minori JPX), Heat transfer member.
    상세보기
  6. Ozmat Burhan (Dallas TX), Heat transfer module for ultra high density and silicon on silicon packaging applications.
    상세보기
  7. Layton Wilbur T. (San Diego CA) Norell Ronald A. (Oceanside CA) Roecker James A. (Escondido CA), Heat transfer module incorporating liquid metal squeezed from a compliant body.
    상세보기
  8. Norell Ronald A. (Oceanside CA) Layton Wilbur T. (San Diego CA) Roecker James A. (Escondido CA), Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring.
    상세보기
  9. Hayes Claude Q. C. (7980 Linda Vista Rd. #49 San Diego CA 92111), Heat-absorbing heat sink.
    상세보기
  10. Jarvela Robert A. (Wappingers Falls NY), High density air cooled wafer package having improved thermal dissipation.
    상세보기
  11. Layton Wilber T. (San Diego CA) Morange Blanquita O. (San Diego CA) Torres Angela M. (Vista CA) Roecker James A. (Escondido CA), Integrated circuit package having a liquid metal-aluminum/copper joint.
    상세보기
  12. Layton Wilbur T. (San Diego CA) Morange Blanquita O. (San Diego CA) Torres Angela M. (Vista CA), Liquid metal heat conducting member and integrated circuit package incorporating same.
    상세보기
  13. Nyul Paul (New Holland PA) Hughes Frederick R. (Lancaster PA), Method of bonding two parts together and article produced thereby.
    상세보기
  14. Whitfield Fred J. (1405 S. Village Way Santa Ana CA 92705) Doyel ; Jr. Arthur T. (4402 Casa Oro Yorba Linda CA 92686), Methods and materials for conducting heat from electronic components and the like.
    상세보기
  15. Altoz Frank E. (Baltimore MD), Module cooling system.
    상세보기
  16. Chisholm ; John, Process for making porous metal heat sink from clad aluminum wire.
    상세보기
  17. Cook, Ronald S.; Token, Kenneth H., Simple thermal joint.
    상세보기
  18. Chiba Akio (Hitachi JPX) Shimizu Seiki (Hitachi JPX) Kuniya Keiichi (Hitachi JPX) Onuki Jin (Hitachi JPX), Stacked structure having matrix-fibered composite layers and a metal layer.
    상세보기
  19. Ostergren Carl D. (Montgomery NY) Paivanas ; deceased John A. (late of Williamsville NY by Sophia Paivanas ; executor), Thermal conduction disc-chip cooling enhancement means.
    상세보기
  20. Altoz Frank E. (Catonsville MD), Thermal coupling to enhance heat transfer.
    상세보기
  21. Daszkowski Joseph M. (New Hyde Park NY), Thermal link.
    상세보기

이 특허를 인용한 특허 (40)

  1. Wang, Hao; Sammakia, Bahgat; Liu, Yayong; Yang, Kaikun, Composite thermal interface material system and method using nano-scale components.
    상세보기
  2. Starkovich, John A.; Tice, Jesse B.; Silverman, Edward M.; Peng, Hsiao-Hu, Compressible, thermally-conductive, removable nanocomposite gasket.
    상세보기
  3. Lee, Tae Soo; Park, Yun Hwi, Electronic chip module.
    상세보기
  4. Kubo,Hideo, Electronic component package including heat spreading member.
    상세보기
  5. Brodsky William Louis ; Kehley Glenn Lee ; Sathe Sanjeev Balwant ; Slack John Robert, Electronic package with heat transfer means.
    상세보기
  6. Yamaguchi Akio,JPX, Heat conductor.
    상세보기
  7. Mita,Kunihiko; Tomaru,Kazuhiko; Aoki,Yoshitaka; Fujiki,Hironao, Heat dissipating member.
    상세보기
  8. Thompson, Alex; Ward, Terence G., Heat transfer plate.
    상세보기
  9. Faybishenko,Victor; Burfield,Ashley, Heat-transfer interface device between a source of heat and a heat-receiving object.
    상세보기
  10. Liang,Chen Jiunn; Yu,Kuo Yu, Heatsink device.
    상세보기
  11. Webb, Brent J., High thermal conductivity heat transfer pad.
    상세보기
  12. Iruvanti, Sushumna; Kemink, Randall G.; Kumar, Rajneesh; Ostrander, Steven P.; Singh, Prabjit, Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package.
    상세보기
  13. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments.
    상세보기
  14. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Method for an integrated circuit thermal grease mesh structure.
    상세보기
  15. Duvall, James H.; Bergerson, Steve; Balian, Charles; Rogove, Arthur H., Method of forming a phase change thermal interface.
    상세보기
  16. Babcock James Wittman ; Tustaniwskyj Jerry Ihor, Method of thermal coupling an electronic device to a heat exchange member while said electronic device is being tested.
    상세보기
  17. Richard F. Hill ; Forest Hampton, III, Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink.
    상세보기
  18. Hill, Richard F.; Strader, Jason L., Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink.
    상세보기
  19. Tina Barcley, Multiple layer thin flexible circuit board.
    상세보기
  20. James H. Duvall ; Steve Bergerson ; Charles Balian ; Arthur H. Rogove, Phase change thermal interface material.
    상세보기
  21. Chiu, Chia-Pin; Shipley, James C.; Simmons, Craig B., Short carbon fiber enhanced thermal grease.
    상세보기
  22. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
    상세보기
  23. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
    상세보기
  24. Salamon, Todd R., Thermal interface device.
    상세보기
  25. Solbrekken, Gary L.; Simmons, Craig B.; Chiu, Chia-Pin, Thermal interface material on a mesh carrier.
    상세보기
  26. Balian,Charles; Bergerson,Steven E.; Currier,Gregg C., Thermal interface material with low melting alloy.
    상세보기
  27. Chainer, Timothy J.; Gaynes, Michael, Thermal interface solution with reduced adhesion force.
    상세보기
  28. Chainer, Timothy J.; Gaynes, Michael, Thermal interface solution with reduced adhesion force.
    상세보기
  29. Rauch, Robert A., Thermal interface wafer and method of making and using the same.
    상세보기
  30. Rauch, Robert A., Thermal interface wafer and method of making and using the same.
    상세보기
  31. Rauch,Robert A., Thermal interface wafer and method of making and using the same.
    상세보기
  32. Choong-Un Kim ; Seung-Mun You, Thermal joint and method of use.
    상세보기
  33. Bunyan, Michael H., Thermal management materials.
    상세보기
  34. Bunyan, Michael H.; Young, Kent M., Thermal management materials having a phase change dispersion.
    상세보기
  35. Wilson, James S., Thermal management system and method for thin membrane type antennas.
    상세보기
  36. Edwards David L. ; Daves Glenn G. ; Farooq Shaji ; Iruvanti Sushumna ; Pompeo Frank L., Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.
    상세보기
  37. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
    상세보기
  38. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Fogel, Keith E.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof.
    상세보기
  39. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Fogel, Keith F.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof.
    상세보기
  40. Bunyan,Michael H.; de Sorgo,Miksa, Thermally or electrically-conductive form-in-place gap filter.
    상세보기

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