초록 ▼

Extension areas of a metal layer electrically connected to the original die bond pad allow for testing connections to be made. In this way, the connection area used for the final packaging of the die will not be damaged. The extension areas can be removed along with the testing connections. The use

Extension areas of a metal layer electrically connected to the original die bond pad allow for testing connections to be made. In this way, the connection area used for the final packaging of the die will not be damaged. The extension areas can be removed along with the testing connections. The use of perforations and/or underlayer sections can aid in the removal of the extension area. The extension area can extend over a passivation layer so that the basic die design need not be changed.

대표청구항 ▼

[ What is claimed is:] [1.] A structure comprising:a die;a wire bond pad on the die;a passivation layer over a portion of the die; anda metal layer on the die and electrically connected to the wire bond pad and extending over a portion of the passivation layer, the metal layer including an extension

[ What is claimed is:] [1.] A structure comprising:a die;a wire bond pad on the die;a passivation layer over a portion of the die; anda metal layer on the die and electrically connected to the wire bond pad and extending over a portion of the passivation layer, the metal layer including an extension area extending beyond the wire bond pad, the metal layer including a plurality of perforations.