초록 ▼

A pressure relief device that is thermally triggered by a shaped memory alloy element. The pressure relief device has a valve body with a passageway that is exposed on one end to a high pressure fluid and on another end to a low pressure fluid. A closure element is moveably mounted with respect to t

A pressure relief device that is thermally triggered by a shaped memory alloy element. The pressure relief device has a valve body with a passageway that is exposed on one end to a high pressure fluid and on another end to a low pressure fluid. A closure element is moveably mounted with respect to the valve body and operates between an open position and a closed position. In the closed position, the closure element preferably prevents communication between the high pressure fluid and the low pressure fluid. In the open position, the high pressure fluid is in communication with the low pressure fluid. The shaped memory alloy element either directly or indirectly interferes with movement of the closure element. The shaped memory alloy element preferably interferes with the closure element to retain the closure element in the closed position. Upon thermal activation, the shaped memory alloy element deforms and allows the closure element to move from the closed position toward the open position.

대표청구항 ▼

[ We claim:] [1.] A pressure relief device comprising:a valve body having a passageway, said passageway having a high pressure end and a low pressure end, a closure element movable with respect to said valve body between an open position and a closed position, in said closed position said closure el

[ We claim:] [1.] A pressure relief device comprising:a valve body having a passageway, said passageway having a high pressure end and a low pressure end, a closure element movable with respect to said valve body between an open position and a closed position, in said closed position said closure element preventing communication between said high pressure end and said low pressure end, in said open position said high pressure end in communication with said low pressure end; anda shaped memory alloy element detached with respect to said closure element, in said closed position said shaped memory alloy element forming an interference with movement of said closure element and retaining said closure element in said closed position, and in said open position said shaped memory alloy element deformed to eliminate said interference.