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A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassett

A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassette from the sides of the cassette. Once gripped, the cassette moves with the transfer device upward along a vertical axis to make room for the platform to be extended from within the processing station to a position under the cassette. Thereafter, the direction of motion of the transfer device is reversed and the cassette is lowered onto the platform. Once seated on the platform, the gripping arms retract from the cassette, and the cassette is carried on the platform into the processing station.

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[ We claim:] [1.] A method of transferring a wafer cassette from within a SMIF pod to a platform capable of extending out of a wafer process chamber to an extended position from a retracted position within the wafer process chamber, the SMIF pod including a pod top and a pod door, the pod door suppo

[ We claim:] [1.] A method of transferring a wafer cassette from within a SMIF pod to a platform capable of extending out of a wafer process chamber to an extended position from a retracted position within the wafer process chamber, the SMIF pod including a pod top and a pod door, the pod door supporting the wafer cassette, the method comprising the steps of:(a) positioning the SMIF pod on an indexer while the platform is in the retracted position, the indexer located along a substantially common vertical axis with the platform when the platform is in the extended position;(b) separating the pod door from the pod top after the SMIF pod is positioned on the indexer in said step (a);(c) raising a port plate of the indexer and the pod top along the vertical axis with respect to the wafer cassette;(d) gripping the cassette with gripping arms mounted in the port plate;(e) raising the cassette gripped in said step (d) along the vertical axis to a position higher than the position of the platform;(f) lowering the cassette raised in said step (e) onto the platform after the platform has been extended; and(g) disengaging the gripping aims from the sides of the cassette gripped in said step (d).