초록 ▼

A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at a chip locus. The method preferably comprises the steps of placing a slug in a die, and exercising the

A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at a chip locus. The method preferably comprises the steps of placing a slug in a die, and exercising the die to cold flow the slug to a predetermined cap configuration. The cap configuration includes a plurality of walls depending from a polygonal generally planar base and cooperating with the base to establish a well bounded by the walls and the base. The walls terminate in a plane, and the well clears the chip when the cap is mounted on the substrate at the chip locus. The invention further includes a cap for use in a semiconductor package. The cap comprises a structure cold flowed from a slug in a die to a predetermined cap configuration. The cap configuration includes a plurality of walls depending from a polygonal generally planar base and cooperates with the polygonal base to establish a well bounded by the plurality of walls and the polygonal base. The walls terminate generally in a termination plane, and the well clears the chip when the cap is abuttingly mounted at the termination plane on the substrate at the chip locus.

대표청구항 ▼

[ We claim:] [1.] A method for manufacturing a cap for use in a semiconductor package; said semiconductor package including a semiconductor chip and a substrate; said chip being mounted with said substrate; the method comprising the steps of:placing a slug in a die;exercising said die to cold flow s

[ We claim:] [1.] A method for manufacturing a cap for use in a semiconductor package; said semiconductor package including a semiconductor chip and a substrate; said chip being mounted with said substrate; the method comprising the steps of:placing a slug in a die;exercising said die to cold flow said slug to a predetermined cap configuration said cap configuration including a plurality of walls depending from a polygonal generally planar base and cooperating with said polygonal base to establish a well bounded by said plurality of walls and said polygonal base; said plurality of walls terminating generally in a termination plane; said well clearing said chip when said cap is abuttingly mounted at said termination plane on said substrate, where said exercising is effected as a coining operation.