초록 ▼

Formed in a portion of a side surface of the heat-sink element, is a relief which has mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface is substantially blocked by an obstructing means which extends to the heat-sink elemen

Formed in a portion of a side surface of the heat-sink element, is a relief which has mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface is substantially blocked by an obstructing means which extends to the heat-sink element outside, toward the peripheral holder structure, such as to only leave a slit open between the obstructing means and the peripheral holder structure of the leadframe next to the first largest surface of the heat-sink element. The mouth formed on the second largest surface is open wide.

대표청구항 ▼

[ What is claimed is:] [1.] A heat-dissipating and supporting structure for a semiconductor electronic device to be encapsulated within a plastic package, formed by a molding process, of the type having a fully insulated heat sink, comprising:a heat-sink element having a first largest surface to be

[ What is claimed is:] [1.] A heat-dissipating and supporting structure for a semiconductor electronic device to be encapsulated within a plastic package, formed by a molding process, of the type having a fully insulated heat sink, comprising:a heat-sink element having a first largest surface to be insulated by means of a plastic material layer with a first thickness, and a second largest surface, opposite from the first largest surface, to be insulated by means of a layer of plastic material with a second thickness which is thin compared to the first thickness; anda leadframe consisting of a metal strip attached to the heat-sink element on the same side as the first largest surface and comprising a peripheral holder structure located outside as regards the heat-sink element; and whereina portion of a side surface of the heat-sink element is formed with a relief having mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface being substantially blocked by an obstructing means which extends outside to the heat-sink element, toward the peripheral holder structure, such as to only leave a slit open between the obstructing means and the peripheral holder structure of the leadframe toward the first largest surface of the heat-sink element, and the mouth formed on the second largest surface being completely open.