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Cooling device for hard to access non-coplanar circuit chips 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-023/12
  • F28D-015/00
출원번호 US-7606184 (1996-12-04)
발명자 / 주소
  • Harris Willard Stephen
  • Kemink Randall Gail
  • McClafferty William David
  • Schmidt Roger Ray
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 43  인용 특허 : 6

초록 ▼

Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the prese

대표청구항

[ The invention claimed is:] [1.] A cooling device comprising:

이 특허에 인용된 특허 (6)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
    상세보기
  2. Klein Phillip P. (Plano TX), Apparatus for localized heat and cold therapy.
    상세보기
  3. Nordin Ronald A. (Naperville IL), Circuit card assembly.
    상세보기
  4. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
    상세보기
  5. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
    상세보기
  6. Hara Shinichi (Yokohama JPX) Ebinuma Ryuichi (Machida JPX), Wafer cooling device.
    상세보기

이 특허를 인용한 특허 (43)

  1. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
    상세보기
  2. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  3. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
    상세보기
  4. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system based on projected conditions.
    상세보기
  5. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
    상세보기
  6. David, Milnes P.; Iyengar, Madhusudan K.; Schmidt, Roger R., Controlled cooling of an electronic system for reduced energy consumption.
    상세보기
  7. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
    상세보기
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
    상세보기
  9. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
    상세보기
  10. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Cooled electronic system with thermal spreaders coupling electronics cards to cold rails.
    상세보기
  11. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
    상세보기
  12. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
    상세보기
  13. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
    상세보기
  14. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
    상세보기
  15. Chiu George Liang-Tai ; Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Electronic component cooling using a heat transfer buffering capability.
    상세보기
  16. Schmidt Roger R. ; Maclachlan William P. ; Horvath Drew R. ; Barringer Dennis R., Enhanced test head liquid cooled cold plate.
    상세보기
  17. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
    상세보기
  18. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
    상세보기
  19. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
    상세보기
  20. Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Heat transfer in electronic apparatus.
    상세보기
  21. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
    상세보기
  22. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
    상세보기
  23. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
    상세보기
  24. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.
    상세보기
  25. LaGrotta James T. ; LaGrotta Richard T., Method and apparatus for heat regulating electronics products.
    상세보기
  26. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  27. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  28. Klein Dean A., Method for attachment or integration of a bios device into a computer system using a local bus.
    상세보기
  29. Chainer, Timothy J.; Gaynes, Michael A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Schultz, Mark D.; Simco, Daniel P.; Steinke, Mark E., Method of fabricating a cooled electronic system.
    상세보기
  30. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
    상세보기
  31. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Vandeventer, Allan C.; Zoodsma, Randy J., Modular pumping unit(s) facilitating cooling of electronic system(s).
    상세보기
  32. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; VanDeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling method for continuous cooling of an electronic system(s).
    상세보기
  33. Goth, Gary F.; Krug, Jr., Francis R.; Mullady, Robert K.; Low, Kevin P.; Vandeventer, Allan C.; Zoodsma, Randy J., Multi-level redundant cooling system for continuous cooling of an electronic system(s).
    상세보기
  34. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
    상세보기
  35. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
    상세보기
  36. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
    상세보기
  37. Mann, Phillip V.; O'Connell, Kevin M.; Sinha, Arvind K.; Stathakis, Karl, Thermal spreading for an externally pluggable electronic module.
    상세보기
  38. Mann, Phillip V.; O'Connell, Kevin M.; Sinha, Arvind K.; Stathakis, Karl, Thermal spreading for an externally pluggable electronic module.
    상세보기
  39. David, Milnes P.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Parida, Pritish R.; Schmidt, Roger R.; Steinke, Mark E., Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s).
    상세보기
  40. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
    상세보기
  41. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
    상세보기
  42. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
    상세보기
  43. Jacob Tzlil IL; Ronen Zagoory IL, Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module.
    상세보기

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