$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Single laser bright field and dark field system for detecting anomalies of a sample 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0611109 (1996-03-05)
발명자 / 주소
  • Vaez-Iravani Mehdi
출원인 / 주소
  • Kla-Tencor Corporation
대리인 / 주소
    Majestic, Parsons, Siebert & Hsue
인용정보 피인용 횟수 : 144  인용 특허 : 0

초록

A single laser is used to provide light for both dark and bright field detection. The laser beam is split into two beams by a Wollaston prism and both beams are directed towards a sample to be inspected to illuminate two areas of the sample. The light reflected by or transmitted through the sample a

대표청구항

[ What is claimed is:] [1.] A system for detecting anomalies of a sample, comprising:means for transmitting to said sample two substantially parallel optical incident beams, said beams being initially coherent but of different polarizations, so that portions of the beams are reflected or transmitted

이 특허를 인용한 특허 (144)

  1. Berejik, Zacharia, Antenna for receiving and/or transmitting polarized communication signals.
  2. Ohshima, Yoshimasa; Noguchi, Minori; Nishiyama, Hidetoshi; Mitomo, Kenji; Okawa, Takashi; Hamamatsu, Akira; Suzuki, Shinichi, Apparatus for detecting foreign particle and defect and the same method.
  3. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, Apparatus for determining optimum position of focus of an imaging system.
  4. Meeks, Steven W.; Kudinar, Rusmin, Combined high speed optical profilometer and ellipsometer.
  5. Meeks,Steven W; Kudinar,Rusmin, Combined high speed optical profilometer and ellipsometer.
  6. Huang,Chunsheng, Darkfield defect inspection with spectral contents.
  7. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  8. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  9. Zhao, Guoheng; Zapalac, Geordie; Ngai, Samuel; Vaez-Iravani, Mehdi; Levy, Ady; Dharmadhikari, Vineet, Defect detection using time delay lock-in thermography (LIT) and dark field LIT.
  10. Xu,James J.; Lee,Ken K., Defect review system with 2D scanning and a ring detector.
  11. Meeks, Steven W.; Xu, Xiaoqian; Nguyen, Hung P.; Moghadam, Alireza Shahdoost; Ramachandran, Mahendra Prabhu, Detecting and classifying surface defects with multiple radiation collectors.
  12. Meeks, Steven W., Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect.
  13. Meeks,Steven W., Detecting multi-domain states in perpendicular magnetic media.
  14. Bechtler,Laurie; Velidandla,Vamsi; Meeks,Steven W., Detecting surface pits.
  15. Nielsen, Henrik K.; Kuhlmann, Lionel; Nokes, Mark, Detection system for nanometer scale topographic measurements of reflective surfaces.
  16. Nielsen,Henrik K.; Kuhlmann,Lionel; Nokes,Mark, Detection system for nanometer scale topographic measurements of reflective surfaces.
  17. Nielsen,Henrik K.; Kuhlmann,Lionel; Nokes,Mark, Detection system for nanometer scale topographic measurements of reflective surfaces.
  18. Hess,Harald F.; Carr,Thomas Daniel; Sappey,Romain, Dynamic reference plane compensation.
  19. Tsai,Bin Ming Benjamin; Chuang,Yung Ho; Armstrong,J. Joseph; Brown,David Lee, Excimer laser inspection system.
  20. Furman, Dov; Neumann, Gad; Dotan, Noam, Fiber optical illumination system.
  21. Furman,Dov, Fiber optical illumination system.
  22. Furman,Dov; Neumann,Gad; Dotan,Noam, Fiber optical illumination system.
  23. Mcmillan, Wayne; Wolters, Christian, Illumination energy management in surface inspection.
  24. Furman, Dov; Kaner, Roy; Gonen, Ori; Mandelik, Daniel; Tal, Eran; Silberstein, Shai, Image splitting in optical inspection systems.
  25. Furman, Dov; Silberstein, Shai; Miklatzky, Effy; Mandelik, Daniel; Abraham, Martin, Image splitting in optical inspection systems.
  26. Horai, Izuo; Koyabu, Hirokazu; Urano, Yuta; Jingu, Takahiro, Inspection method and inspection device.
  27. Horai, Izuo; Koyabu, Hirokazu; Urano, Yuta; Jingu, Takahiro, Inspection method and inspection device.
  28. Vaez Iravani,Mehdi, Inspection system for integrated applications.
  29. Capaldo,Kevin Patrick; Cheverton,Mark Allen; Coyle,Dennis Joseph; Davis,Michael John; Talsania,Sameer Kirti; Yamada,Masako; Yeung,Chung hei, Integrated inspection system and defect correction method.
  30. Matsui, Shigeru; Oku, Mizuki, Light source device, surface inspecting apparatus using the device, and method for calibrating surface inspecting apparatus using the device.
  31. Matsui, Shigeru; Oku, Mizuki, Light source device, surface inspecting apparatus using the device, and method for calibrating surface inspecting apparatus using the device.
  32. Meeks, Steven W., Material independent optical profilometer.
  33. Meeks,Steven W., Material independent optical profilometer.
  34. Meeks, Steven W., Material independent profiler.
  35. Ohshima, Yoshimasa; Noguchi, Minori; Nakano, Hiroyuki, Method and apparatus for detecting defects.
  36. Ohshima,Yoshimasa; Iwata,Hisafumi; Nakano,Hiroyuki, Method and apparatus for detecting defects.
  37. Sali, Erez; Yanir, Tomer; Wagner, Mark; Dotan, Noam; Dorfan, Yuval; Zaslavsky, Ran, Method and apparatus for detecting defects in wafers.
  38. Dorphan, Yuval; Zaslavsky, Ran; Wagner, Mark; Furman, Dov; Silberstein, Shai, Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images.
  39. Sasazawa, Hideaki; Ishiguro, Takayuki; Horie, Kiyotaka; Yanaka, Yu, Method and apparatus for inspecting a surface of a substrate.
  40. Toker,Gregory; Brunfeld,Andrei; Lutsker,Ilia, Method and apparatus for simultaneous 2-D and topographical inspection.
  41. Drent, William Van; Vajda, Ferenc, Method and system for perpendicular magnetic media metrology.
  42. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  43. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  44. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  45. Togashi, Takahiro; Matsui, Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  46. Togashi,Takahiro; Matsui,Shigeru, Method for detecting particles and defects and inspection equipment thereof.
  47. John C. Stover ; Yuri A. Eremin RU, Method for discriminating between holes in and particles on a film covering a substrate.
  48. Rossman, Kent; Olmer, Leonard Jay; Nguyen, Phillip, Method for using an in situ particle sensor for monitoring particle performance in plasma deposition processes.
  49. Meeks,Steven W., Method of detecting and classifying scratches and particles on thin film disks or wafers.
  50. Meeks, Steven W., Method of detecting and classifying scratches, particles and pits on thin film disks or wafers.
  51. Moghaddam, Alireza Shahdoost; Nguyen, Hung Phi, Method of detecting the thickness of thin film disks or wafers.
  52. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process.
  53. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation.
  54. Fielden,John; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Wack,Dan, Methods and systems for determining a composition and a thickness of a specimen.
  55. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a critical dimension an a presence of defects on a specimen.
  56. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension and a thin film characteristic of a specimen.
  57. Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension and overlay of a specimen.
  58. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdul-Halim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  59. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdul-Halim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  60. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdulhalim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  61. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen.
  62. Bultman,Gary; Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Wack,Dan; Fielden,John, Methods and systems for determining a presence of defects and a thin film characteristic of a specimen.
  63. Bultman, Gary; Levy, Ady; Brown, Kyle A.; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a presence of macro and micro defects on a specimen.
  64. Bultman,Gary; Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Wack,Dan; Fielden,John, Methods and systems for determining a presence of macro and micro defects on a specimen.
  65. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a presence of macro defects and overlay of a specimen.
  66. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a presence of macro defects and overlay of a specimen.
  67. Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process.
  68. Wack,Dan; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Fielden,John, Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography.
  69. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen.
  70. Fielden,John; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Wack,Dan, Methods and systems for determining a thin film characteristic and an electrical property of a specimen.
  71. Wack,Dan; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Fielden,John, Methods and systems for determining an adhesion characteristic and a thickness of a specimen.
  72. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining an implant characteristic and a presence of defects on a specimen.
  73. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining at least four properties of a specimen.
  74. Wack, Dan; Levy, Ady; Brown, Kyle A.; Smedt, Rodney C.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen.
  75. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining flatness, a presence of defects, and a thin film characteristic of a specimen.
  76. Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Bultman,Gary; Wack,Dan; Fielden,John, Methods and systems for determining overlay and flatness of a specimen.
  77. Shortt, David; Biellak, Stephen; Belyaev, Alexander, Methods and systems for inspection of a wafer.
  78. Jak, Martin Jacobus Johan; Den Boef, Arie Jeffrey; Ebert, Martin, Metrology method, target and substrate.
  79. Furman,Dov; Dotan,Noam; Miklatzky,Efraim, Multi mode inspection method and apparatus.
  80. Meeks, Steven W., Multi-wavelength system and method for detecting epitaxial layer defects.
  81. Leigh, Joseph; Kuo, David S., Optical equipment assemblies and techniques.
  82. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  83. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  84. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  85. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  86. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  87. Matsui, Shigeru, Optical inspection method and optical inspection apparatus.
  88. Wolf William Edward, Optical probe having an imaging apparatus.
  89. Heine, Wolfgang; Spriegel, Dieter; Stockmann, Michael; Weber, Martin, Optical sensor and method for optically inspecting surfaces.
  90. Nishiyama, Hidetoshi; Shimura, Kei; Uto, Sachio; Noguchi, Minori, Pattern defect inspection apparatus and method.
  91. Nishiyama, Hidetoshi; Shimura, Kei; Uto, Sachio; Noguchi, Minori, Pattern defect inspection apparatus and method.
  92. Fuchs, Dan T.; Silberstein, Shai, Printed fourier filtering in optical inspection tools.
  93. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  94. Chuang, Yung Ho; Armstrong, J. Joseph, Reducing variations in energy reflected from a sample due to thin film interference.
  95. Mehdi Vaez-Iravani ; Stanley Stokowski ; Guoheng Zhao, Sample inspection system.
  96. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  97. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  98. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  99. Vaez-Iravani Mehdi ; Stokowski Stanley ; Zhao Guoheng, Sample inspection system.
  100. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  101. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  102. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  103. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  104. Hou,Zhen; Soetarman,Ronny; Velidandla,Vamsi; Meeks,Steven W., Servo pattern characterization on magnetic disks.
  105. Vaez-Iravani, Mehdi; Miller, Lawrence Robert, Simultaneous multi-spot inspection and imaging.
  106. Meeks, Steven W.; Sappey, Romain; Carr, Tom, Surface characteristic analysis.
  107. Oak, Dave S.; Do, Tri; Soetarman, Ronny; Meeks, Steven W.; Velidandla, Vamsi, Surface finish roughness measurement.
  108. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  109. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  110. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  111. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  112. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  113. Matsui, Shigeru, Surface inspection method and surface inspection apparatus.
  114. Matsui, Shigeru; Hachiya, Masayuki, Surface inspection method and surface inspection apparatus.
  115. Matsui, Shigeru; Hachiya, Masayuki, Surface inspection method and surface inspection apparatus.
  116. Matsui,Shigeru, Surface inspection method and surface inspection apparatus.
  117. Xu,James J.; Lee,Ken K., Surface inspection system.
  118. Mehanian,Courosh; Meeks,Steven W.; Rosengaus,Eliezer, Surface scanning.
  119. Soetarman,Ronny; Velidandla,Vamsi M.; Leung,Jimmy; Meeks,Steven W., System and method for automatically determining magnetic eccentricity of a disk.
  120. Velidandla,Vamsi, System and method for classifying, detecting, and counting micropipes.
  121. Meeks,Steven W., System and method for double sided optical inspection of thin film disks or wafers.
  122. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring object characteristics using phase differences in polarized light reflections.
  123. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring properties of an object using a phase difference between two reflected light signals.
  124. Moghadam,Alireza Shahdoost; Velidandla,Vamsi Mohan, System and method for optimizing wafer flatness at high rotational speeds.
  125. Li, Shifang; Wen, Youxian, System and method for semiconductor wafer inspection and metrology.
  126. Huang, Chuanyong; Li, Qing; Pettibone, Donald; Graves, Buzz, System and method for simultaneous dark field and phase contrast inspection.
  127. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, System for detection of wafer defects.
  128. Furman,Dov; Neumann,Gad; Wagner,Mark; Dotan,Noam; Segal,Ram; Silberstein,Shai, System for detection of wafer defects.
  129. Neumann,Gad; Dotan,Noam, System for detection of wafer defects.
  130. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, System for detection of water defects.
  131. Meeks, Steven W.; Kudinar, Rusmin, System for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern.
  132. Biellak, Steve; Stokowski, Stanley E.; Vaez-Iravani, Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  133. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  134. Marella,Paul Frank, Systems and methods for closed loop defect reduction.
  135. Biellak,Stephen; Shortt,David, Systems and methods for determining a characteristic of a specimen.
  136. Vaez Iravani, Mehdi; Biellak, Stephen, Systems and methods for inspecting wafers.
  137. Rosengaus,Eliezer; Young,Lydia, Systems and methods for inspection of specimen surfaces.
  138. Kadkly, Azmi; Biellak, Stephen; Vaez-Iravani, Mehdi, Systems configured to inspect a wafer.
  139. Almogy, Gilad; Mazaki, Hadar; Phillip, Zvi Howard; Reinhorn, Silviu; Goldberg, Boris; Some, Daniel I., Variable angle illumination wafer inspection system.
  140. Meeks, Steven W.; Kudinar, Rusmin, Wafer edge inspection.
  141. Meeks, Steven W.; Kudinar, Rusmin; Wheeler, William R.; Nguyen, Hung Phi; Velidandla, Vamsi; Somanchi, Anoop; Soetarman, Ronny, Wafer edge inspection.
  142. Fossey Michael E. ; Stover John C., Wafer inspection system for distinguishing pits and particles.
  143. Fossey Michael E. ; Stover John C. ; Clementi Lee D., Wafer inspection system for distinguishing pits and particles.
  144. Fossey, Michael E.; Stover, John C.; Clementi, Lee D., Wafer inspection system for distinguishing pits and particles.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로