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Flexible multilayer printed circuit boards and methods of manufacture

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/56
출원번호 US-0543623 (1995-10-16)
발명자 / 주소
  • Anderson David Allen
  • Myers Carol Rita
  • Saari Matthew John
출원인 / 주소
  • Sheldahl, Inc.
대리인 / 주소
    Merchant, Gould, Smith, Edell, Welter & Schmidt, P.A.
인용정보 피인용 횟수 : 51  인용 특허 : 76

초록

Flexible multilayer printed circuit boards are disclosed which utilize adhesiveless laminates interconnected in a generally superposed relationship by a conductive adhesive. In one embodiment, the adhesiveless laminates have relatively thin conductive layers and metallized through holes which exhibi

대표청구항

[ We claim:] [1.] A method of manufacturing a flexible multilayer printed circuit board, comprising the steps of:(a) constructing at least two adhesiveless laminates, wherein the construction of each adhesiveless laminate comprises the steps of:(i) forming at least one through hole through a flexibl

이 특허에 인용된 특허 (76)

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  49. Yoshizawa Tetsuo (Yokohama JPX) Terayama Yoshimi (Odawara JPX) Kondo Hiroshi (Yokohama JPX) Sakaki Takashi (Tokyo JPX) Haga Shunichi (Yokohama JPX) Ichida Yasuteru (Machida JPX) Konishi Masaki (Ebina, Method of producing electrical connection members.
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  53. Burgess Larry W. (Tigard OR), Multilayer circuit board manufacturing.
  54. Taylor Glen J. (Winter Park FL), Multilayer circuit board with integral flexible appendages.
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  56. Needham Barbara (Bishop\s Stortford GB2), Permanently connecting a set of conductive tracks on a substrate with a co-operating set on a printed circuit.
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  58. Strobel Jean-Paul (Avully CHX), Printed circuit board and process for its manufacture.
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  62. Barton Carlos L. (Brooklyn CT) Lindsay Adrienne (Chandler AZ) Henson Samuel W. (Mesa AZ), Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefro.
  63. Bronnenberg David L. (Riviera AZ), Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefro.
  64. Lundberg Werner (Egebjergvej DKX) Winzer Helmut (Kevelaer DEX), Process for the manufacture of printed circuit boards.
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  66. Oizumi Masayuki (Ohtsu JPX) Abe Masaharu (Kobe JPX) Fushiki Yasuo (Takatsuki JPX), Production of metal clad laminates.
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  71. Cleemput Camiel D. (Wondelgem - Gent BEX), Screen printing process and apparatus and electrical printed circuits obtained therewith.
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  74. Essinger Walter F. (Thousand Oaks CA), Thin-film EL panel mounting unit.
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  76. Lifshin Eric (Loudonville NY) Cargioli Joseph D. (Schenectady NY) Schroder Stephen J. (Schenectady NY) Wong Joe (Schenectady NY), Transfer lamination of vapor deposited foils, method and product.

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