|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||B32B-003/02 B32B-015/04 B22D-003/00 B22F-005/00|
|미국특허분류(USC)||428/157 ; 156/219 ; 156/222 ; 156/251 ; 428/133 ; 428/134 ; 428/164 ; 428/166 ; 428/172 ; 428/457 ; 428/544 ; 428/571 ; 428/594 ; 428/600 ; 428/603 ; 428/606 ; 428/607 ; 428/615|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 55 인용 특허 : 134|
A pad including thermal insulation and heat sink areas. The pad includes a plurality of layers of metal foil forming a stack with the layers arranged one above the other, the stack including at least one heat sink area and at least one insulating area adjacent to the heat sink area, the layers providing better heat conduction in the vertical direction at the heat sink area than at the insulating area. At least one of the layers includes a plurality of embossments therein separating the one layer from an adjacent one of the layers in the insulating area. ...
[ What is claimed is:] [1.] A pad including at least one compressed portion forming a heat sink area and at least one thermal insulating area, comprising:a plurality of interior layers of metal foil between a top layer and a bottom layer of metal foil forming a stack wherein said layers are arranged one above another in said at least one compressed portion forming the heat sink area and in said at least one thermal insulating area, at least one of said layers including plurality of embossments therein separating said at least one of said layers from an a...