초록 ▼

To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a non-conductive substrate without plating sprea

To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a non-conductive substrate without plating spread.

대표청구항 ▼

[ We claim:] [1.] An electroless gold plating bath comprising a water-soluble gold plating bath comprising a water-soluble salt of a gold sulfite in an amount of 1 to 20 grams/liter of gold ion, a complexing agent selected from the group consisting of alkali metal and ammonium salts of sulfite, and

[ We claim:] [1.] An electroless gold plating bath comprising a water-soluble gold plating bath comprising a water-soluble salt of a gold sulfite in an amount of 1 to 20 grams/liter of gold ion, a complexing agent selected from the group consisting of alkali metal and ammonium salts of sulfite, and EDTA in an amount of 5 to 200 grams/liter, a reducing agent selected from the group consisting of ascorbic acid and water-soluble salts thereof in an amount of 1 to 100 grams/liter, and polyvinyl pyrrolidone in an amount of 0.1 to 100 mg/liter, said electroless gold plating bath having a pH of 6 to 9.