초록

Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.

대표청구항 ▼

[ What is claimed is:] [1.] A method of preparing preforms suitable for encapsulating electrical or electronic devices comprising:A. introducing a thermoset resin formulation into an injection molding device via a powder feeding unit connected thereto and then warming said thermoset resin formulatio

[ What is claimed is:] [1.] A method of preparing preforms suitable for encapsulating electrical or electronic devices comprising:A. introducing a thermoset resin formulation into an injection molding device via a powder feeding unit connected thereto and then warming said thermoset resin formulation to form a warm melt without substantially curing said resin;B. injecting said warm melt into a mold without substantially curing said thermoset resin;C. cooling said warm melt in said mold to form a solidified molding in the form of a preform, and removing said preform from said mold without substantially curing said thermoset resin, said preform having a density that is at least 95% of a theoretical maximum preform density.