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Infrared ray detection device and solid-state imaging apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/101
  • H01L-031/0232
  • G01J-005/20
  • G01T-001/20
출원번호 US-0738108 (1996-10-25)
우선권정보 JP-0335275 (1995-12-22)
발명자 / 주소
  • Akagawa Keiichi,JPX
  • Komai Atsushi,JPX
출원인 / 주소
  • Nikon Corporation, JPX
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 35  인용 특허 : 5

초록

An infrared ray detection device of this invention includes (i) a silicon substrate, (ii) a plurality of light-receiving portions which are disposed at predetermined intervals on one surface of the silicon substrate, and receive infrared rays, (iii) a plurality of reading portions which are disposed

대표청구항

[ What is claimed is:] [1.] An imaging apparatus comprising:an image sensor;a lens for directing visible light rays and infrared rays towards the image sensor; anda stop disposed between the image sensor and the lens and made of material that shields the visible light rays but permits transmission o

이 특허에 인용된 특허 (5)

  1. Reffner John A. (Stamford CT) Wihlborg William T. (Milford CT), Infrared microspectrometer accessory.
  2. Kuffer Fernand B. (Brea CA), Multi-spectral target detection system with common collecting means.
  3. Su Stephen C. (San Clemente CA) Finnila Ronald M. (Carlsbad CA), Signal detection method for IR detector having charge readout structure.
  4. Andressen Clarence C. (Fredericksburg VA), Unitary lasser/IR seeker.
  5. Herring James R. (San Marcus CA) Gates James L. (Vista CA), Wideband schottky focal plane array.

이 특허를 인용한 특허 (35)

  1. Oh, Kwang Seok; Park, Jong Wook; Park, Young Kuk; Min, Byoung Youl, Adhesive on wire stacked semiconductor package.
  2. Oh, Kwang Seok; Park, Jong Wook; Park, Young Kuk; Min, Byoung Youl, Adhesive on wire stacked semiconductor package.
  3. Webster,Steven, Camera module fabrication method including singulating a substrate.
  4. Webster,Steven, Camera module fabrication method including the step of removing a lens mount and window from the mold.
  5. Webster,Steven, Camera module having a threaded lens barrel and a ball grid array connecting device.
  6. Glenn, Thomas P.; Webster, Steven, Camera module with window mechanical attachment.
  7. Vozka, Stanislav; Podolak, Miroslav, Device for UV-spectrometric analysis of gaseous compounds.
  8. de Guzman, Arsenio; Darveaux, Robert F.; Kim, Young Ho, Direct glass attached on die optical module.
  9. Luc, Tai P.; Gamboa, Claudia V.; Johnson, Mark E.; Hanak, Daniel J., Dispensing systems with improved sensing capabilities.
  10. Yudaya R. Sivathanu ; Rony K. Joseph, Fast infrared linear image optical instruments.
  11. Kaushal,Tej Paul; Manning,Paul Antony; Gillham,John Peter; Stacey,Gary; Pooley,David Martin; Laitenberger,Peter Georg, Hermetic packaging.
  12. Maeda, Kiyohiro, Image capturing system, image capturing method, and recording medium.
  13. Yamaguchi, Hiroshi, Image capturing system, image capturing method, and recording medium.
  14. Lee,Chang Deok; Na,Do Hyun, Image sensor package and its manufacturing method.
  15. Paek,Jong Sik; Jang,Ho Cheol; Seo,Seong Min, Image sensor package and its manufacturing method.
  16. Craig,Richard A.; Griffin,Jeffrey W., Infra-red detector and method of making and using same.
  17. Leydier, Robert A.; Bonvalot, Béatrice, Integrated circuit chip made secure against the action of electromagnetic radiation.
  18. Kim, Youn Sang; Kim, Bong Chan; Kim, Yoon Joo, Method of making semiconductor package with adhering portion.
  19. Webster, Steven, Molded image sensor package and method.
  20. Webster, Steven, Molded semiconductor package.
  21. Webster, Steven, Molded semiconductor package with snap lid.
  22. Yang,Jun Young; Lee,Sang Ho; Park,Chul Woo, Optic semiconductor module and manufacturing method.
  23. Webster, Steven; Glenn, Thomas P.; Hollaway, Roy Dale, Optical module having cavity substrate.
  24. Webster,Steven; Glenn,Thomas P.; Hollaway,Roy Dale, Optical module with lens integral holder fabrication method.
  25. Dainty, Christopher; Goncharov, Alexander; Corcoran, Peter; Andorko, Istvan, Optical system for acquisition of images with either or both visible or near-infrared spectra.
  26. Yu, Shih Hung, Remote-controllable electronic device.
  27. Horikoshi, Katsu; Uchiyama, Hisayoshi; Noma, Takashi; Seki, Yoshinori; Yamada, Hiroshi; Ishibe, Shinzo; Shinogi, Hiroyuki, Semiconductor device.
  28. Okada, Kazuo; Kitagawa, Katsuhiko; Noma, Takashi; Otsuka, Shigeki; Yamada, Hiroshi; Ishibe, Shinzo; Morita, Yuichi; Okubo, Noboru; Shinogi, Hiroyuki; Okigawa, Mitsuru, Semiconductor device.
  29. Noma, Takashi; Okada, Kazuo; Ishibe, Shinzo; Kitagawa, Katsuhiko; Morita, Yuichi; Otsuka, Shigeki; Yamada, Hiroshi; Okubo, Noboru; Shinogi, Hiroyuki; Okigawa, Mitsuru, Semiconductor device and manufacturing method of the same.
  30. Kim, Youn Sang; Kim, Bong Chan; Kim, Yoon Joo, Semiconductor package.
  31. Glenn,Thomas P.; Webster,Steven, Snap lid camera module.
  32. Takeuchi, Yutaka; Shibata, Katsuhiro; Uya, Shinji; Shizukuishi, Makoto, Solid state imaging device incorporating a light shielding film having openings of different sizes.
  33. Abe Hideshi,JPX, Solid-state imaging sensor, manufacturing method thereof and imaging device.
  34. St. Amand, Roger D.; Han, ChangSuk; Kim, YounSang; Park, KyungRok; Perelman, Vladimir, Stacked electronic component package having film-on-wire spacer.
  35. Senekerimyan, Vahan, Viewport protector for an extreme ultraviolet light source.
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