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A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as su

A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.

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[ What is claimed is:] [1.] A semiconductor device comprising a semiconductor chip electrically connected to a wiring substrate, said chip having a thickness of 0.3 mm or less and a plurality of electrodes on a peripheral portion, the wiring substrate having a plurality of electrodes corresponding t

[ What is claimed is:] [1.] A semiconductor device comprising a semiconductor chip electrically connected to a wiring substrate, said chip having a thickness of 0.3 mm or less and a plurality of electrodes on a peripheral portion, the wiring substrate having a plurality of electrodes corresponding to the electrodes of the semiconductor chip, and an adhesive layer present between the semiconductor chip and the wiring substrate, said electrodes of at least one of the semiconductor chip and the wiring substrate being projected from an insulating plane to a predetermined height, a plurality of spacer elements having almost the same height as the predetermined height of the electrodes projecting from the insulating plane and having at least one shape selected from circles and polygons when seen from a plan view being present in an area surrounded by the electrodes on the peripheral portion of the semiconductor chip after connection.