초록

In alternative embodiments, the standoff contains a flange having a plurality of apertures useful for either mechanically locking an adhesive or for enabling irradiation of an adhesive by a light source. The standoff may contain protrusions for alignment, strength or circuit routing.

대표청구항 ▼

[ I claim:] [11.] A ball grid array electronic package, comprising:a base having a central portion and a peripheral portion;a plurality of circuit traces formed on the peripheral portion of said base, each of said circuit traces having an inner end adjacent the central portion of said base and an ex

[ I claim:] [11.] A ball grid array electronic package, comprising:a base having a central portion and a peripheral portion;a plurality of circuit traces formed on the peripheral portion of said base, each of said circuit traces having an inner end adjacent the central portion of said base and an external end forming a point on an array formed on said peripheral portion of said base;solder balls having a diameter bonded to points of said array;a semiconductor device bonded to said central portion and electrically interconnected to said inner ends of said circuit traces; anda standoff having first and second opposing sides with a height less than the diameter of said solder balls having said second side bonded to said base circumscribing a perimeter of said central portion thereof.