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Method of electrochemical mechanical planarization 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0827340 (1997-03-26)
발명자 / 주소
  • Uzoh Cyprian Emeka
  • Harper James McKell Edwin
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Abate
인용정보 피인용 횟수 : 299  인용 특허 : 0

초록 ▼

A method of planarizing a layer of a workpiece such as a semiconductor wafer includes rotating the layer against an electrolytic polishing slurry and flowing an electrical current through the slurry and through only one major side and/or minor sides of the layer, to remove portions of the layer. The

대표청구항 ▼

[ What is claimed is:] [1.] A method of planarizing a workpiece including major sides and minor sides, one of the major sides and parts of the minor sides being formed of a layer to be planarized, said method comprising:rotating the layer;pressing the rotating layer against an electrolytic polishing

이 특허를 인용한 특허 (299)

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