초록 ▼

A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising a deformable layer (14) for accommodating unevenness of the surface of a substrate, and a patterned layer on the deformable layer in which a lithographic pattern is engraved. The stamp structure

A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising a deformable layer (14) for accommodating unevenness of the surface of a substrate, and a patterned layer on the deformable layer in which a lithographic pattern is engraved. The stamp structure is further enhanced by comprising a third layer (16), which acts as rigid support for the stamp, thus preventing an undesired deformation of the stamp under load.

대표청구항 ▼

[ We claim:] [1.] A stamp structure for a lithographic process, comprising a deformable first layer of a first material, and a second layer of a second material positioned on said deformable first layer, said second layer having a lithographic pattern to be transferred to a substrate, said deformabl

[ We claim:] [1.] A stamp structure for a lithographic process, comprising a deformable first layer of a first material, and a second layer of a second material positioned on said deformable first layer, said second layer having a lithographic pattern to be transferred to a substrate, said deformable first layer deforming to permit conformal contact of said second layer to the surface of said substrate at times a load is applied.