초록 ▼

Methods of producing a chip scale package that enables any chip with peripheral bond pads to be converted to an area array chip scale package suitable for chip on board assembly. The present invention produces the equivalent of a flip chip die when a chip supplier does not provide one. Processing is

Methods of producing a chip scale package that enables any chip with peripheral bond pads to be converted to an area array chip scale package suitable for chip on board assembly. The present invention produces the equivalent of a flip chip die when a chip supplier does not provide one. Processing is performed that provides thin film metal interconnections between the chip bond pads and area array bond pads on the bottom of the package. High reliability thin film metal interconnections are thus provided that connect the bond pads of the chip to the area array bond pads to permit external connection to the chip.

대표청구항 ▼

[ What is claimed is:] [1.] A method of fabricating a high density multilayer interconnect (HDMI) decal chip scale package, said method comprising the steps of:depositing and curing a layer of polyimide on a transparent substrate;depositing and patterning pad metal comprising metal pads on the layer

[ What is claimed is:] [1.] A method of fabricating a high density multilayer interconnect (HDMI) decal chip scale package, said method comprising the steps of:depositing and curing a layer of polyimide on a transparent substrate;depositing and patterning pad metal comprising metal pads on the layer of polyimide;depositing and curing a second layer of polyimide over the metal pads;patterning and etching vias to the metal pads;depositing and patterning a metal interconnect layer that provides for connection to the metal pads;depositing and curing a third layer of polyimide over the metal interconnect layer;applying a layer of adhesive to areas where chips are to be attached;attaching chips face down onto the layer of adhesive so that their peripheral bond pads are adhesively attached to the third layer of polyimide;attaching a plate to backs of the chips to produce an HDMI decal;delaminating the HDMI decal from the transparent substrate;forming vias through the second and third layers of polyimide to expose selected metal pads and portions of the metal interconnect layer;depositing a second metal interconnect layer on the exposed surface of the second and third layer of polyimide;depositing a layer of dielectric material on the surface of the second metal interconnect layer to fill depressions therein where the vias were formed;curing the dielectric material to form an etch mask to protect regions where contact between the metal pads and the metal interconnect layer is made;etching the surface of the HDMI decal through the layer of dielectric material forming the etch mask;depositing area array bonding pads in a predetermined configuration to connect to the metal pads that permit external connection to the chip;separating the chips from each other; andreleasing the separated chips from the plate.