초록 ▼

The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated i

The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.

대표청구항 ▼

[ What is claimed as new and for which Letters Patent of the United States are desired to be secured is:] [1.] A heat dissipating computer case comprising:at least one heat conducting external wall of a computer case constructed of a plastic material with heat conducting fibers embedded within the p

[ What is claimed as new and for which Letters Patent of the United States are desired to be secured is:] [1.] A heat dissipating computer case comprising:at least one heat conducting external wall of a computer case constructed of a plastic material with heat conducting fibers embedded within the plastic material, with the fibers oriented so that they conduct heat from a holding fixture to a surface of the wall which is exposed to ambient air;the holding fixture attached to the inside surface of the external computer case wall which has embedded heat conducting fibers; anda heat pipe held in the holding fixture in thermal contact with the heat conducting fibers in the wall to which the holding fixture is attached.