초록 ▼

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.

대표청구항 ▼

[ What is claimed is:] [1.] A solder preform, adapted in use for forming solder balls on a surface of at least one electronic component or for forming solder joints between two electronic components, comprising:a plurality of relatively large solid solder masses connected to one another by a relativ

[ What is claimed is:] [1.] A solder preform, adapted in use for forming solder balls on a surface of at least one electronic component or for forming solder joints between two electronic components, comprising:a plurality of relatively large solid solder masses connected to one another by a relatively thin sheet of solder; andweakening lines extending between the solder masses;wherein:the weakening lines are regions of reduced thickness.