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Temperature control system for an electronic device which achieves a quick response by interposing a heater between the 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-001/02
출원번호 US-0833369 (1997-04-04)
발명자 / 주소
  • Tustaniwskyj Jerry Ihor
  • Babcock James Wittman
출원인 / 주소
  • Unisys Corporation
대리인 / 주소
    Fassbender
인용정보 피인용 횟수 : 40  인용 특허 : 8

초록

A temperature control system comprises: an electric heater that has a first face which makes contact with an electronic device, and a second face which is opposite the first face; a heat sink, coupled to the second face of the heater, which absorbs heat from the electronic device through the heater'

대표청구항

[ What is claimed is:] [1.] A temperature control system which maintains the temperature of an electronic device near a set point temperature; said system comprising:an electric heater that has a first face for making contact with said electronic device, and a second face which is opposite said firs

이 특허에 인용된 특허 (8)

  1. Jones Elmer R. (North Reading MA), Burn-in module.
  2. Tuckerman David B. (Dublin CA) Patel Pradip D. (Redwood City CA), Burn-in technologies for unpackaged integrated circuits.
  3. Wojnarowski Robert J. (Ballston Lake NY) Eichelberger Charles W. (Schenectady NY), Direct patterning of metals over a thermally inefficient surface using a laser.
  4. Burolla Vincent A. (Ontario NY), Ink manifold having elastomer channel plate for ink jet printhead and process for making.
  5. Benko John W. (Trenton NJ) Coucoulas Alexander (Basking Ridge NJ), Laser soldering method and apparatus.
  6. McDaniel Kent T. (Eau Claire) Johnson David J. (Chippewa Falls) Krajewski Nicholas J. (Chippewa Falls) LeMay David W. (Eau Claire WI), Method and apparatus for laser masking of lead bonding.
  7. Danssaert John L. (San Diego CA) Shopes Robert J. (San Diego CA) Shoemaker Daniel D. (Stanford CA), Thermal cycler including a temperature gradient block.
  8. Atkins Glen G. (Boise ID) Cohen Michael S. (Boise ID) Mauritz Karl H. (Eagle ID) Shaffer James M. (Boise ID 4), Wafer scale burn-in apparatus and process.

이 특허를 인용한 특허 (40)

  1. Turner, Jonathan E., Active power monitoring using externally located current sensors.
  2. Kabbani,Samer; Beyerle,Rick; Bachelder,Don, Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing.
  3. Wall, Charles B.; Barnes, Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  4. Wall,Charles B.; Barnes,Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  5. DiBattista, Larry; Malinoski, Mark; Shitara, Tomoya, Apparatus and method for temperature control of IC device during test.
  6. Johnson James E. ; Darcy Ronald J., Apparatus capable of high power dissipation during burn-in of a device under test.
  7. Yoshikawa Minoru,JPX, Apparatus for monitoring ventilation of integrated circuits in electronic apparatus.
  8. Malinoski, Mark F.; Jones, Thomas P.; Annis, Brian; Turner, Jonathan E., Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices.
  9. Mark F. Malinoski ; Thomas P. Jones ; Brian Annis ; Jonathan E. Turner, Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices.
  10. Mark F. Malinoski ; Thomas P. Jones ; Brian Annis ; Jonathan E. Turner, Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device.
  11. Johnson, James E.; Darcy, Ronald J., Burn-in board with adaptable heat sink device.
  12. Tustaniwskyj, Jerry Ihor; Babcock, James Wittman, Chip tester having a heat-exchanger with an extendable period of operation.
  13. Venzke,Stephen Bolin, Constant-power constant-temperature resistive network.
  14. Venzke,Stephen Bolin, Constant-power constant-temperature resistive network.
  15. Kurokawa, Tateki; Saito, Akira; Fukukawa, Toshio; Harada, Mikio; Daikoku, Takahiro; Yazawa, Hideo, Cooling apparatus for electronic unit.
  16. Maeda, Masami; Shimojima, Toshioki, Handler provided with a temperature control unit.
  17. Wetzel, Stephen Aloysius; Trieu, Thanh, Heat sink pedestal with interface medium chamber.
  18. Yamashita,Tsuyoshi, Heater-equipped pusher, electronic component handling apparatus, and temperature control method for electronic component.
  19. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  20. Gaasch, Thomas Francis; Trieu, Thanh, Method for controlling the temperature of an electronic component under test.
  21. Burger Jan,DEX ; Henze Rainer,DEX ; Starlinger-Huemer Franz X.,ATX, Method for the regulation of the temperature of the heated air in an apparatus for the hot-air pasting of plastic films.
  22. Gamache, Roger G.; Gardell, David L.; Knox, Marc D., Method of burning in an integrated circuit chip package.
  23. Tustaniwskyi,Jerry Ihor; Babcock,James Wittman, Method of maintaining an IC-module near a set-point.
  24. Wetzel, Stephen Aloysius; Trieu, Thanh, Method of manufacturing a heat sink pedestal device with interface medium chamber.
  25. Slocum,Alexander H.; Pfahnl,Andreas C., Method of providing direct impingement temperature control of a device.
  26. Pfahnl, Andreas C.; Dunn, Jr., John J., Methods and apparatus for testing a semiconductor structure using improved temperature desoak techniques.
  27. Noel,Michael A.; Grover,Douglas R., Methods of testing electronic devices.
  28. Roy,Shambhu N., Micro thermal chamber having proximity control temperature management for devices under test.
  29. Kabbani, Samer, Miniature fluid-cooled heat sink with integral heater.
  30. Kabbani, Samer, Miniature fluid-cooled heat sink with integral heater.
  31. Barcley, Tina P., Remote thermal vias for densely packed electrical assemblage.
  32. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Residue-free method of assembling and disassembling a pressed joint with low thermal resistance.
  33. Pfahnl, Andreas C.; Moore, John D., Semiconductor handler for rapid testing.
  34. Gaasch, Thomas Francis; Trieu, Thanh, Temperature control device for an electronic component.
  35. Jones, Thomas P.; Turner, Jonathan E.; Malinoski, Mark F., Temperature control of electronic devices using power following feedback.
  36. Thomas P. Jones ; Jonathan E. Turner ; Mark F. Malinoski, Temperature control of electronic devices using power following feedback.
  37. Alexander H. Slocum ; Andreas C. Pfahnl ; Ernest P. Walker ; Ronald A. Sartschev, Temperature control structure.
  38. Lopez, Christopher A.; Davis, Rick A., Thermal clutch for thermal control unit and methods related thereto.
  39. Feder, Jan; Beyerle, Rick; Byers, Stephen; Jones, Thomas, Thermal control of a DUT using a thermal control substrate.
  40. Feder,Jan; Beyerle,Rick; Byers,Stephen; Jones,Thomas, Thermal control of a DUT using a thermal control substrate.
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