초록 ▼

A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b o

A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

대표청구항 ▼

[ What is claimed is:] [1.] A method for testing a semiconductor element having electrical connection electrodes which comprises the steps of:forming protruding electrodes on a test substrate having test wires to electrically connect the protruding electrodes with the test wires;bonding the electric

[ What is claimed is:] [1.] A method for testing a semiconductor element having electrical connection electrodes which comprises the steps of:forming protruding electrodes on a test substrate having test wires to electrically connect the protruding electrodes with the test wires;bonding the electrical connection electrodes of the semiconductor element to the protruding electrodes of the test substrate;testing the semiconductor element in a heated atmosphere; andremoving the protruding electrodes from the test substrate together with the electrical connection electrodes of the semiconductor element by removing the semiconductor element from the test substrate after the step of testing the semiconductor element.