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Focused air cooling employing a dedicated chiller 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-023/12
  • H05K-007/20
출원번호 US-0778706 (1997-01-03)
발명자 / 주소
  • Alexander Arthur Ray
  • Porter
  • deceased Warren W.
출원인 / 주소
  • NCR Corporation
대리인 / 주소
    Merchant, Gould, Smith, Edell, Welter & Schmidt
인용정보 피인용 횟수 : 45  인용 특허 : 10

초록

A cooling system for cooling computer components generating thermal energy. The cooling system includes a high efficiency heat exchanger attached to the heat producing component and an evaporator. The heat exchanger comprises a hollow body formed of a thermally conductive material having a coolant i

대표청구항

[ What is claimed is:] [1.] An electrical component cooling system, comprising:means for generating a flow of air;an expansion device for cooling the flow of air to provide a cooled airflow;a heat exchanger in thermal contact with the component and in communication with and attached proximate to sai

이 특허에 인용된 특허 (10)

  1. Harvey William J. (Hoboken NJ), Air conditioning control system.
  2. Lopez Roger (Louisville CO), Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor.
  3. Anderson Jared A. (Woodside CA) Van Gelder Robert V. (Berkeley CA) Yazolino Lauren F. (Oakland CA) Braun Jimmy E. (Orange CA), Circuit board mounting and cooling assembly.
  4. Azar Kaveh (Westwood MA), Circuit pack with inboard jet cooling.
  5. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  6. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  7. McCoy Joseph R. (Frankfort NY), Cryogenic packaging for uniform cooling.
  8. Porter Warren W. (Escondido CA), Electrically-operated heat exchanger release mechanism.
  9. Porter Warren W. (Escondido CA) Wall ; III Charles B. (Irmo SC), Focused CPU air cooling system including high efficiency heat exchanger.
  10. Smith Grant M. (Bryn Athyn PA) Romania Samuel R. (Phoenixville PA) Gibbs Ronald T. (King of Prussia PA), Parallel-flow air system for cooling electronic equipment.

이 특허를 인용한 특허 (45)

  1. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  2. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  3. Pfister Dennis M. ; Byrd Charles M., Circuit board having an integral sorber.
  4. Scott, Alexander Robin Walter, Computer cooling apparatus.
  5. Scott,Alexander Robin Walter, Computer cooling apparatus.
  6. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  7. Goldowsky Michael Philip ; Chiu George Liang-Tai ; Mok Lawrence Shungwei ; Ellis Arthur W., Contactless hermetic pump.
  8. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  9. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  10. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  11. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  12. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  13. Cheon Kioan, Cooling apparatus for electronic devices.
  14. Chandrakant D. Patel, Cooling arrangement for high performance electronic components.
  15. Hamman,Brian A., Cooling system.
  16. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  17. Day, Tony, Data center cooling.
  18. Day, Tony, Data center cooling.
  19. Day, Tony, Data center cooling.
  20. Day, Tony, Data center cooling.
  21. Day, Tony, Data center cooling.
  22. Hirano, Toshiki, Disk array system with internal environmental controls.
  23. Kondo,Yoshihiro; Ohashi,Shigeo; Minamitani,Rintaro; Naganawa,Takashi; Yoshitomi,Yuji; Nakanishi,Masato; Sasaki,Yasuhiko; Nakagawa,Tsuyoshi; Suzuki,Osamu; Matsushita,Shinji; Yamada,Yasunori, Electronic equipment.
  24. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device.
  25. Teneketges,Nicholas J.; Kwok,Tarzen, Heat exchange apparatus with parallel flow.
  26. Andrew W. Batchelor AU; Ben Banney AU; David McDonald AU; Tilak T. Chandratilleke AU, Heat exchanger for an electronic heat pump.
  27. Batchelor, Andrew W.; Banney, Ben; McDonald, David; Chandratilleke, Tilak T., Heat exchanger for an electronic heat pump.
  28. Hamman,Brian A., Liquid cooling system.
  29. Cader,Tahir; Ressa,Robert J., Low momentum loss fluid manifold system.
  30. Bhatia,Rakesh, Method and apparatus for cooling electronic equipment within an enclosure.
  31. Davidson,Howard, Method and apparatus for making a sorber.
  32. Jeong,In Kwon, Multi-channel temperature control system for semiconductor processing facilities.
  33. Jeong,In Kwon, Multi-channel temperature control system for semiconductor processing facilities.
  34. Dreier Kenneth ; Garcia Marvin P., Outdoor equipment cabinet.
  35. Berstis, Viktors, Quiet “fan”.
  36. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  37. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  38. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  39. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  40. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
  41. Sishtla Vishnu M. ; Stark Michael A., System for removing parasitic losses in a refrigeration unit.
  42. Hamman, Brian Alan, System processor heat dissipation.
  43. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  44. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
  45. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.
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