$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"
쳇봇 이모티콘
안녕하세요!
ScienceON 챗봇입니다.
궁금한 것은 저에게 물어봐주세요.

특허 상세정보

Chemical-mechanical polish (CMP) pad conditioner

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B24B-049/00    B24B-051/00   
미국특허분류(USC) 451/09 ; 451/09 ; 451/041 ; 451/285
출원번호 US-0654503 (1996-05-28)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Saile
인용정보 피인용 횟수 : 92  인용 특허 : 10
초록

An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.

대표
청구항

[ What is claimed is:] [1.] A method for conditioning a polishing pad comprising the steps of:providing said polishing pad affixed to a rotatable polishing platen, said polishing pad having a counter-electrode embedded therein;providing a rotating pad conditioner having an abrasive surface affixed thereon, a pad conditioner holder, and a plurality of electrodes embedded in the pad conditioner holder and abrasive surface;providing a means for holding said abrasive surface of said rotating pad conditioner in juxtaposition relative to said rotating polishin...

이 특허에 인용된 특허 (10)

  1. Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX) Horie Hiroshi (Kawasaki JPX) Sugimoto Fumitoshi (Kawasaki JPX). Apparatus and method for uniformly polishing a wafer. USP1996105562529.
  2. Doy Toshiroh K. (Tokorozawa JPX) Nakada Hiroshi (Tokyo JPX) Kunimitsu Yoshihiko (Shinnanyo JPX). Apparatus for polishing. USP1991075032203.
  3. Burke Peter A. (Austin TX) Freeman Eric H. (Underhill Center VT) Ross Gilbert H. (Burlington VT). Chemical-mechanical polishing tool with end point measurement station. USP1996025492594.
  4. Tsai Chia S. (Hsin-chu TWX) Tseng Pin-Nan (Hsin-chu TWX). Chemical/mechanical planarization (CMP) apparatus and polish method. USP1996115575706.
  5. Chen Lai-Juh (Hsin-Chu TWX). Electrochemical simulator for chemical-mechanical polishing (CMP). USP1997065637031.
  6. Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID) Fox Angus C. (Boise ID) Sandhu Gurtej S. (Boise ID) Stroupe Hugh E. (Boise ID). Method and apparatus for improving planarity of chemical-mechanical planarization operations. USP1993085232875.
  7. Leach Michael A. (South Burlington VT) Machesney Brian J. (Burlington VT) Nowak Edward J. (Essex Junction VT). Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th. USP1992075132617.
  8. Young Ralph W. (Poughkeepsie NY). Method of semiconductor device representation for fast and inexpensive simulations of semiconductor device manufacturing. USP1996015481475.
  9. Blackwell, Robert E.. Removing slurry residue from semiconductor wafer planarization. USP1994065320706.
  10. Pasch Nicholas F. (Pacifica CA) Mallon Thomas G. (Santa Clara CA) Franklin Mark A. (Scott\s Valley CA). Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers. USP1994055310455.

이 특허를 인용한 특허 피인용횟수: 92

  1. Paik,Young J.. Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error. USP2008037349753.
  2. Lee,Ji Myong. Apparatus and methods of chemical mechanical polishing. USP2006027005383.
  3. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M.. Article for polishing semiconductor substrates. USP2006037014538.
  4. Li,Shijian; Chen,Llang Yuh; Duboust,Alain. Articles for polishing semiconductor substrates. USP2006067059948.
  5. Schwarm,Alexander T.. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools. USP2008027333871.
  6. Kramer, Jens. Chemical mechanical polishing method and apparatus. USP2016049312142.
  7. He, Yanghua; Chen, Jingqiu; Leng, Yaojian. Chemical mechanical polishing pad having improved groove pattern. USP2011088002611.
  8. Kirchner Eric J. ; Kalpathy-Cramer Jayashree. Chemical-mechanical polishing pad conditioning systems. USP2000076093280.
  9. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.. Compact grinding wheel. USP2018029902035.
  10. Drill Charles F. ; Gabriel Calvin ; Weling Milind ; Russ Richard ; Henderson David E.. Complementary material conditioning system for a chemical mechanical polishing machine. USP2000026022265.
  11. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan. Computer integrated manufacturing techniques. USP2007027174230.
  12. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan. Computer integrated manufacturing techniques. USP2006067069101.
  13. Mavliev,Rashid A.; Wadensweiler,Ralph M.. Conductive pad. USP2008097427340.
  14. Mavliev, Rashid A.; Karuppiah, Lakshmanan. Conductive pad design modification for better wafer-pad contact. USP2009047520968.
  15. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert. Conductive pad with ion exchange membrane for electrochemical mechanical polishing. USP2008037344432.
  16. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph. Conductive polishing article for electrochemical mechanical polishing. USP2008057374644.
  17. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain. Conductive polishing article for electrochemical mechanical polishing. USP2007107278911.
  18. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D.. Conductive polishing article for electrochemical mechanical polishing. USP2006067066800.
  19. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D.. Conductive polishing article for electrochemical mechanical polishing. USP2006016988942.
  20. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D.. Conductive polishing article for electrochemical mechanical polishing. USP2006117137879.
  21. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D.. Conductive polishing article for electrochemical mechanical polishing. USP2007127311592.
  22. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson. Conductive polishing article for electrochemical mechanical polishing. USP2005126979248.
  23. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou. Conductive polishing article for electrochemical mechanical polishing. USP2007047207878.
  24. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou. Conductive polishing article for electrochemical mechanical polishing. USP2006016991528.
  25. Liu, Feng Q.; Mavliev, Rashid. Contact assembly and method for electrochemical mechanical processing. USP2010037670468.
  26. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan. Contacts for electrochemical processing. USP2009087569134.
  27. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan. Contacts for electrochemical processing. USP2006107125477.
  28. Mavliev,Rashid; Tsai,Stan; Hu,Yongqi; Butterfield,Paul; Manens,Antoine; Chen,Liang Yuh. Contacts for electrochemical processing. USP2007127303662.
  29. Shanmugasundram, Arulkumar; Parikh, Suketu A.. Copper wiring module control. USP2011088005634.
  30. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing. USP2010087783375.
  31. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing. USP2010057725208.
  32. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing. USP2010047698012.
  33. Paik, Young Jeen. Dynamic offset and feedback threshold. USP2005116961626.
  34. Chi, Yueh-Shian; Hawkins, Parris C M; Huang, Charles Q.. Dynamic subject information generation in message services of distributed object systems. USP2013088504620.
  35. Chi,Yueh shian T.; Hawkins,Parris C. M.; Huang,Charles Q.. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility. USP2007037188142.
  36. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh. Edge bead removal by an electro polishing process. USP2007127303462.
  37. Wang, Yuchun; Ewald, Robert A.; Hsu, Wei-Yung; Chen, Liang-Yuh. Extended pad life for ECMP and barrier removal. USP2011098012000.
  38. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B.. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles. USP2014048694145.
  39. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Prabhu,Gopalakrishna B.. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles. USP2007017160739.
  40. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Iliopoulos, Ilias; Parkhomovsky, Alexander; Seamons, Martin J.. Feedback control of plasma-enhanced chemical vapor deposition processes. USP2005076913938.
  41. Paik,Young Joseph. Feedforward and feedback control for conditioning of chemical mechanical polishing pad. USP2006097101799.
  42. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi. Full sequence metal and barrier layer electrochemical mechanical processing. USP2008117446041.
  43. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi. Full sequence metal and barrier layer electrochemical mechanical processing. USP2006087084064.
  44. Chi, Yuehshian T.; Hawkins, Parris C. M.; Jin, Qiaolin. Generic interface builder. USP2004036708074.
  45. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.. Grinding wheel arbor. USP2016109475175.
  46. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.. Grinding wheel with identification tag. USP2017069669508.
  47. Chopra, Dinesh; Meikle, Scott. Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning. USP2013108557132.
  48. Chopra, Dinesh; Meikle, Scott. Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning. USP2005066911111.
  49. Chopra, Dinesh; Meikle, Scott. Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning. USP2004056736926.
  50. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.. Integrating tool, module, and fab level control. USP2006057047099.
  51. Reiss,Terry P.; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.. Integration of fault detection with run-to-run control. USP2008027337019.
  52. Boyd, John M.; Owczarz, Aleksander; Saldana, Miguel. Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system. USP2003066579407.
  53. Boyd,John M.; Owczarz,Aleksander; Saldana,Miguel. Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system. USP2006047025854.
  54. Wang, Yan; Neo, Siew; Liu, Feng; Tsai, Stan D.; Hu, Yongqi; Duboust, Alain; Manens, Antoine; Wadensweiler, Ralph M.; Mavliev, Rashid; Chen, Liang-Yuh; Olgado, Donald J. K.; Butterfield, Paul D.; Tseng, Ming-Kuei; Chang, Shou-Sung; Sun, Lizhong. Method and apparatus for electrochemical mechanical processing. USP2010037678245.
  55. Tsai, Stan; Liu, Feng Q.; Wang, Yan; Mavliev, Rashid; Chen, Liang-Yuh; Duboust, Alain. Method and apparatus for local polishing control. USP2010117842169.
  56. Fisher ; Jr. Thomas R. ; Jaso Mark A. ; Stevens ; Jr. Leonard C.. Method and apparatus for monitoring polishing pad wear during processing. USP2001026186864.
  57. Moore,Scott E.. Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface. USP2006127144304.
  58. Moore,Scott E.. Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface. USP2006026997789.
  59. Moore,Scott E.. Method and apparatus for planarizing a microelectronic substrate with a tilted planarizing surface. USP2006067063595.
  60. Fisher ; Jr. Thomas R. ; Jaso Mark A. ; Stevens ; Jr. Leonard C.. Method and apparatus of monitoring polishing pad wear during processing. USP2000046045434.
  61. Glashauser,Walter; Utess,Benno; Purath,Andreas. Method and configuration for conditioning a polishing pad surface. USP2006087097535.
  62. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Pan,Rong; Hernandez,Manuel; Mohammad,Amna. Method of feedback control of sub-atmospheric chemical vapor deposition processes. USP2007047201936.
  63. Donald F. Canaperi ; Jack Oon Chu ; Guy M. Cohen ; Lijuan Huang ; John Albrecht Ott ; Michael F. Lofaro. Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP). USP2002116475072.
  64. Nikolay Korovin. Method to mathematically characterize a multizone carrier. USP2002106468131.
  65. Kokotov,Yuri; Entin,Efim; Seror,Jacques; Fisher,Yossi; Sarel,Shalomo; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Paik,Young Jeen. Method, system and medium for controlling manufacture process having multivariate input parameters. USP2007097272459.
  66. Al Bayati,Amir; Adibi,Babak; Foad,Majeed; Somekh,Sasson. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements. USP2007057225047.
  67. Shanmugasundram,Arulkumar P.; Armer,Helen; Schwarm,Alexander T.. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities. USP2006077082345.
  68. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Seror,Jacques; Kokotov,Yuri; Entin,Efim. Method, system, and medium for handling misrepresentative metrology data within an advanced process control system. USP2006026999836.
  69. Somekh, Sasson; Grunes, Howard E.. Multi-tool control system, method and medium. USP2003106640151.
  70. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M.. Pad assembly for electrochemical mechanical polishing. USP2007107285036.
  71. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M.. Pad assembly for electrochemical mechanical processing. USP2006117137868.
  72. Chang,Shou Sung; Tsai,Stan D; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M.. Pad assembly for electrochemical mechanical processing. USP2006047029365.
  73. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh. Pad assembly for electrochemical mechanical processing. USP2008037344431.
  74. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh. Pad assembly for electrochemical mechanical processing. USP2006077077721.
  75. Torii Kouzi,JPX. Polishing apparatus having a material for adjusting a surface of a polishing pad and method for adjusting the surface of the polishing pad. USP2000086095908.
  76. Doan Trung T. ; Sandhu Gurtej S.. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates. USP1999126004196.
  77. Doan,Trung T.; Sandhu,Gurtej S.. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates. USP200607RE39195.
  78. Kawashima Kiyotaka,JPX. Polishing solution supply system. USP2001096293849.
  79. Yashiki Hiroshi,JPX ; Ishibashi Kouji,JPX. Polishing system and method of control of same. USP2000066074275.
  80. Paik,Young J.. Process control by distinguishing a white noise component of a process variance. USP2007057221990.
  81. Paik,Young Jeen. Process control by distinguishing a white noise component of a process variance. USP2006087096085.
  82. Manens,Antoine P.; Chen,Liang Yuh. Process control in electrochemically assisted planarization. USP2007117294038.
  83. Manens,Antoine P.. Processing pad assembly with zone control. USP2007037186164.
  84. Padhi,Deenesh; Gandikota,Srinivas; Naik,Mehul; Parikh,Suketu A.; Dixit,Girish A.. Selective metal encapsulation schemes. USP2007047205228.
  85. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.. Skate blade retention mechanism. USP2017029566682.
  86. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.; Hastings, Zachary S.. Skate blade sharpening system. USP201708D793830.
  87. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.; Hanczor, Matt. Skate blade sharpening system with alignment adjustment. USP20180910065282.
  88. Layton, Jr., Russell K.; Beaudet, Daniel A.; Goryachev, Ivan D.; Hanczor, Matt. Skate blade sharpening system with alignment adjustment using alignment wheel. USP2017029573236.
  89. Schwarm,Alexander T.. System, method, and medium for monitoring performance of an advanced process control system. USP2008047356377.
  90. Surana,Rahul; Zutshi,Ajoy. Technique for process-qualifying a semiconductor manufacturing tool using metrology data. USP2008047354332.
  91. Janzen, John W.. Ultrasonic conditioning device cleaner for chemical mechanical polishing systems. USP2005046878045.
  92. Janzen, John W.. Ultrasonic conditioning device cleaner for chemical mechanical polishing systems. USP2005066908371.