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Chemical-mechanical polish (CMP) pad conditioner

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B24B-049/00    B24B-051/00   
미국특허분류(USC) 451/09 ; 451/09 ; 451/041 ; 451/285
출원번호 US-0654503 (1996-05-28)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Saile
인용정보 피인용 횟수 : 92  인용 특허 : 10
초록

An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.

대표
청구항
▼

[ What is claimed is:] [1.] A method for conditioning a polishing pad comprising the steps of:providing said polishing pad affixed to a rotatable polishing platen, said polishing pad having a counter-electrode embedded therein;providing a rotating pad conditioner having an abrasive surface affixed thereon, a pad conditioner holder, and a plurality of electrodes embedded in the pad conditioner holder and abrasive surface;providing a means for holding said abrasive surface of said rotating pad conditioner in juxtaposition relative to said rotating polishin...

이 특허에 인용된 특허 (10)

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  7. Leach Michael A. (South Burlington VT) Machesney Brian J. (Burlington VT) Nowak Edward J. (Essex Junction VT). Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th. USP1992075132617.
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