|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||451/09 ; 451/09 ; 451/041 ; 451/285|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 92 인용 특허 : 10|
An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.
[ What is claimed is:] [1.] A method for conditioning a polishing pad comprising the steps of:providing said polishing pad affixed to a rotatable polishing platen, said polishing pad having a counter-electrode embedded therein;providing a rotating pad conditioner having an abrasive surface affixed thereon, a pad conditioner holder, and a plurality of electrodes embedded in the pad conditioner holder and abrasive surface;providing a means for holding said abrasive surface of said rotating pad conditioner in juxtaposition relative to said rotating polishin...