초록 ▼

A method of making a thermoelectric device comprises forming electrodes on a surface of a first substrate and on a surface of a second substrate. Thereafter, a P-type thermoelectric material plate is bonded to the surface of the first substrate having the electrodes, and an N-type thermoelectric mat

A method of making a thermoelectric device comprises forming electrodes on a surface of a first substrate and on a surface of a second substrate. Thereafter, a P-type thermoelectric material plate is bonded to the surface of the first substrate having the electrodes, and an N-type thermoelectric material plate is bonded to the surface of the second substrate having the electrodes. Each of the thermoelectric material plates are then processed by cutting and removing portions thereof to form P-type and N-type thermoelectric material chips bonded to the first and second substrates, respectively. Thereafter, the N-type thermoelectric material chips of the second substrate are bonded to the electrodes of the first substrate, and the P-type thermoelectric material chips of the first substrate are bonded to the electrodes of the second substrate to form PN-junctions between the first and second substrates.

대표청구항 ▼

[ What is claimed is:] [1.] A method of making a thermoelectric device, comprising the steps of: forming electrodes on each of two sheets of substrates; bonding a P-type thermoelectric material plate to one of the substrates; bonding an N-type thermoelectric material plate to the other of the substr

[ What is claimed is:] [1.] A method of making a thermoelectric device, comprising the steps of: forming electrodes on each of two sheets of substrates; bonding a P-type thermoelectric material plate to one of the substrates; bonding an N-type thermoelectric material plate to the other of the substrates; cutting and eliminating portions of each bonded thermoelectric material plate to form separate substrates bonded with P-type and N-type thermoelectric material chips, respectively; and integrating the thermoelectric device by opposing the substrate bonded with the P-type thermoelectric material chips to the substrate bonded with the N-type thermoelectric material chips and bonding the electrodes formed on the substrates to distal ends of the thermoelectric material chips to thereby form pairs of PN-junctions.