초록 ▼

A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one r

A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor die carrier configured to be secured to a printed circuit board having a first side and a second side opposite to the first side, the semiconductor die carrier comprising:a housing for a semiconductor die, the housing having a top surface, a bottom surface

[ What is claimed is:] [1.] A semiconductor die carrier configured to be secured to a printed circuit board having a first side and a second side opposite to the first side, the semiconductor die carrier comprising:a housing for a semiconductor die, the housing having a top surface, a bottom surface, and a plurality of lateral surfaces coupling the top surface and the bottom surface;a first row of conductive leads extending from at least one of the lateral surfaces of the housing; anda second row of conductive leads extending from the at least one lateral surface of the housing, each of the leads of the first and second rows of conductive leads having a proximal end and a distal end having a contact surface, the proximal ends of the leads from the first row of leads being vertically spaced from the proximal ends of the leads from the second row of leads, and the contact surfaces of the leads from the first and second rows of leads in their entirety being substantially coplanar and being configured to be secured to the first side of the printed circuit board such that, when the contact surfaces of the leads are secured to the first side of the printed circuit board, at least a portion of the housing is located below an upper surface of the first side of the printed circuit board.