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Combination heat sink and air duct for cooling processors with a series air flow 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0729815 (1996-10-08)
발명자 / 주소
  • Gandre Jerry
  • Schmitt Ty
출원인 / 주소
  • Dell U.S.A., L.P.
대리인 / 주소
    Haynes and Boone, L.L.P.
인용정보 피인용 횟수 : 50  인용 특허 : 0

초록

A method and apparatus for dissipating heat from an electrical device and ducting air from one place to another. In a computer having several heat producing devices, one heat sink is thermally attached to each one of the devices. Each of the heat sinks has a base, two side walls and a top wall formi

대표청구항

[ What is claimed is:] [1.] A computer comprising:a plurality of heat producing devices;a plurality of heat sinks, one for each of the heat producing devices, wherein each of the heat sinks comprises:a base having a top surface and bottom surface, wherein the bottom surface is thermally attached to

이 특허를 인용한 특허 (50)

  1. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  2. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  3. Cravens,Zachary A.; Wobig,Eric C., Adjustable heat sink shroud.
  4. Brooks, Michael Alan; Wilson, Jeremy, Airflow blocker component that comprises a flexible flap portion.
  5. Barsun,Stephan K., Airflow control baffle.
  6. Johnson Robert W. ; Eddings ; II Richard L. ; Curlee James D., Apparatus and method for mounting and cooling a system component assembly in a computer.
  7. Shawn P. Hoss ; Brently L. Cooper, Apparatus for cooling heat generating devices.
  8. Rochel Sohail ; Norvell Gene Edgar, Car amplifier incorporating a peltier device for cooling.
  9. Peter Erik W. ; Olsen Jeff J., Circuit board with interleaved TO-220 heat sinks.
  10. Jacob Nelik, Computer component cooling assembly.
  11. Nelik Jacob, Computer component cooling assembly.
  12. Brooks,Michael A.; Larson,Thane M., Computer cooling system and method.
  13. Yu,Wen Lung; Chou,Ying Chun; Lu,Kun Chih, Computer heat dissipating system.
  14. Wang Ray ; Liu Peter, Computer processor/heat sink assembly having a dual direction air flow path.
  15. Osborn, Jay K.; Wilson, Helenaur, Computing apparatus with cooling fan.
  16. Behl Sunny, Convectively cooled memory storage device housing.
  17. Lee, Wook Jin; Kim, Sung Tae; Lee, Yong Ho; Park, Young Chal; Shin, Se Hoon, Cooling device for electronic machine.
  18. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Behar Moises ; Dutta Arindum ; Link Kevin J. ; Ahearn Bill, Cooling system for semiconductor die carrier.
  19. Sumida Tatsuya,JPX, Electric connection box.
  20. Dean, David L.; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
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  22. Kajiura,Katsuyuki, Electronic equipment.
  23. Dean, David Lee; Ellis, Robert W., Electronic system with heat extraction and method of manufacture thereof.
  24. Bestwick, Graham Spencer, Electronics assembly with cooling arrangement.
  25. Bollesen Vernon P., Fan heat sink and method.
  26. Rolf A. Konstad, Fan-cooled card.
  27. Jia Hao Li TW, Heat dissipating apparatus with nest wind duct.
  28. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
  29. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
  30. Zhu, Chao-Jun; Zeng, Xiang-Kun; Yao, Zhi-Jiang; Xu, Li-Fu, Heat dissipation system.
  31. Seaton, David W.; Powell, Mark H.; Taylor, Jason R.; Mendenhall, Eric, Heat dissipation system for audio amplifier.
  32. Katsui, Tadashi, Heat sink and information processor using heat sink.
  33. Peterson,Gregory A.; Stebner,Jeffrey S., Heat sink for printed circuit board components.
  34. North, Mark T.; Koffs, Steven E., Heat sink with converging device.
  35. Hsieh, Yi-Hwa; Chen, Yao-Cheng, Heat-dissipating module and electronic device using same.
  36. Ishii,Hideo; Katooka,Masao; Nakata,Kazunori; Ikejiri,Yuji, Heat-generating component cooling structure.
  37. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  38. Al-Garni, Ahmed Z.; Hawwa, Muhammad A., Hybrid cooling system and method for cooling electronic devices.
  39. Tadashi Katsui JP; Keizo Takemura JP; Minoru Hirano JP; Masumi Suzuki JP; Yoshiaki Udagawa JP; Masuo Ohnishi JP; Kenichi Fujii JP, Method of controlling cooling device in portable electronic and cooling device therefor.
  40. Behl,Sunny, Removable memory storage device carrier having a heat sink.
  41. Dean, David; Ellis, Robert, System and method for heat dissipation.
  42. Ellis, Robert W.; Dean, David, System and method for redirecting airflow across an electronic assembly.
  43. Dean, David Lee; Ellis, Robert W.; Harrow, Scott, Test system with localized heating and method of manufacture thereof.
  44. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
  45. Shogan, Gregory; Dunham, John Maynard, Thermal control through a channel structure.
  46. Dean, David; Ellis, Robert W., Thermal isolation techniques.
  47. Ellis, Robert W.; Dean, David, Thermal tube assembly structures.
  48. Hutchinson, David F.; McGowan, Matthew J., Variable length and directional cooling duct.
  49. Macika, Raymond E.; Loose, Timothy C., Wagering game terminal with internal cooling.
  50. Huang, Meng-Chou, Wind guide device for CPU cooler.
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