초록

The heat dissipated by the integrated circuit (11) is evacuated into a plate (13) having an extended surface in order to transmit the heat into the integrated circuit package (10) and into the wiring board (12) by means of the input-output terminals (17) of the package.

대표청구항 ▼

[ I claim:] [1.] A package (10) comprising an integrated circuit (11) adapted to be mounted to a wiring board (12), external terminals (17) connecting the package to the wiring board (12), the package including a connection support (15) connecting the external terminals to the integrated circuit, a

[ I claim:] [1.] A package (10) comprising an integrated circuit (11) adapted to be mounted to a wiring board (12), external terminals (17) connecting the package to the wiring board (12), the package including a connection support (15) connecting the external terminals to the integrated circuit, a heat conductive plate (13) connected to one surface of the integrated circuit for transmitting heat dissipated by the integrated circuit into the package, the plate extending beyond said surface of the integrated circuit over at least a number of said external terminals, the extended portion of the plate being thermally connected with the connection support over said number of external terminals to transfer a substantial part of heat from the integrated circuit through the plate and into the connection support (15) through, and means (15a, 19, 24) for facilitating the evacuation of the heat from the connection support, at least a portion of the heat transferred into the connection support being evacuated through the external terminals of the package.